Intel Corporation
10AS048E4F29I3LG
10AS048E4F29I3LG ECAD Model
10AS048E4F29I3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 480000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA780,28X28,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AS048E4F29I3LG Overview
The chip model 10AS048E4F29I3LG is a cutting-edge integrated circuit designed for use in a variety of applications. It is a high-performance, low-power device that is well-suited for use in a variety of embedded systems. The chip model 10AS048E4F29I3LG is a highly advanced device that provides a wide range of features and capabilities. It is designed to meet the needs of a variety of system designs, including those requiring high-speed operation and high-performance computing.
The chip model 10AS048E4F29I3LG is designed to provide a high level of performance and power efficiency. It is designed to provide a wide range of features and capabilities, including support for high-speed communications and advanced signal processing. The chip model 10AS048E4F29I3LG is also designed to be extremely power-efficient, making it ideal for use in battery-powered applications.
The chip model 10AS048E4F29I3LG is designed to meet the needs of a variety of system designs, including those requiring high-speed operation and high-performance computing. It is designed to provide a wide range of features and capabilities, including support for high-speed communications and advanced signal processing. The chip model 10AS048E4F29I3LG is also designed to be extremely power-efficient, making it ideal for use in battery-powered applications.
The chip model 10AS048E4F29I3LG is expected to be in high demand in the near future due to its advanced features and capabilities. This chip model is expected to be widely used in a variety of industries, including consumer electronics, automotive, and communications. The demand for this chip model is expected to increase as more applications require advanced features and capabilities.
The original design intention of the chip model 10AS048E4F29I3LG was to provide a high level of performance and power efficiency. It is designed to meet the needs of a variety of system designs, including those requiring high-speed operation and high-performance computing. The chip model 10AS048E4F29I3LG is also designed to be extremely power-efficient, making it ideal for use in battery-powered applications.
The chip model 10AS048E4F29I3LG has the potential to be upgraded in the future to support new technologies. It is designed to be flexible and able to adapt to new technologies as they become available. This flexibility makes it possible for the chip model 10AS048E4F29I3LG to be used in a variety of applications, including those requiring advanced communication systems.
In conclusion, the chip model 10AS048E4F29I3LG is a cutting-edge integrated circuit designed for use in a variety of applications. It is designed to provide a high level of performance and power efficiency, and is expected to be in high demand in the near future due to its advanced features and capabilities. The chip model 10AS048E4F29I3LG is also designed to be flexible and able to adapt to new technologies as they become available, making it possible for the chip model 10AS048E4F29I3LG to be used in a variety of applications, including those requiring advanced communication systems.
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5,032 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6,754.6115 | $6,754.6115 |
| 10+ | $6,681.9813 | $66,819.8125 |
| 100+ | $6,318.8301 | $631,883.0097 |
| 1000+ | $5,955.6789 | $2,977,839.4710 |
| 10000+ | $5,447.2673 | $5,447,267.3250 |
| The price is for reference only, please refer to the actual quotation! | ||