Intel Corporation
10AS032E4F29E3SG
10AS032E4F29E3SG ECAD Model
10AS032E4F29E3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 320000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA780,28X28,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AS032E4F29E3SG Overview
The chip model 10AS032E4F29E3SG has become increasingly popular in the semiconductor industry due to its versatile capabilities and cost-effectiveness. It is manufactured by a leading semiconductor company and is designed to meet the needs of a wide range of applications. This chip model is an advanced system-on-chip (SoC) that integrates multiple components into a single integrated circuit (IC). It is designed to reduce the number of components and simplify the design process.
The 10AS032E4F29E3SG chip model is suitable for various applications, including communication, automotive, consumer electronics, industrial automation, medical, and more. It provides a wide range of features and benefits that make it suitable for a variety of applications. It is capable of high-speed data transmission and can support a variety of communication protocols. It also supports a wide range of operating systems, including Linux, Windows, and Android.
The 10AS032E4F29E3SG chip model has a powerful processor core, which is capable of running multiple applications simultaneously. It also features a high-speed memory controller, which can support up to 8GB of DDR3 memory. Additionally, it has an integrated graphics processor, which can support up to 4K resolution. It also has a variety of I/O ports, including USB, HDMI, Ethernet, and more.
The 10AS032E4F29E3SG chip model has become increasingly popular in the semiconductor industry due to its versatility and cost-effectiveness. It is expected to have a strong demand in the future, especially in the automotive, consumer electronics, medical, and industrial automation sectors. As the chip model is designed to reduce the number of components and simplify the design process, it is expected to be used in a variety of applications in the future.
In order to ensure the successful implementation of the 10AS032E4F29E3SG chip model, it is important to understand the product description and specific design requirements of the chip model. It is also important to consider the application environment and determine whether the application requires the support of new technologies. Additionally, it is important to consider the industry trends and future development of related industries in order to ensure that the chip model meets the requirements of the application.
When designing the 10AS032E4F29E3SG chip model, it is important to consider the various components of the chip model, such as the processor core, memory controller, graphics processor, and I/O ports. It is also important to consider the various operating systems that the chip model is capable of supporting. Additionally, it is important to consider the various communication protocols that the chip model is capable of supporting.
Finally, it is important to consider the various industry trends and future development of related industries in order to ensure that the chip model meets the requirements of the application. It is also important to consider the actual case studies and precautions when designing the chip model in order to ensure its successful implementation. By considering the various components, operating systems, and communication protocols, as well as the industry trends and future development of related industries, the 10AS032E4F29E3SG chip model can be designed to meet the requirements of the application.
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5,577 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,037.7701 | $3,037.7701 |
| 10+ | $3,005.1059 | $30,051.0594 |
| 100+ | $2,841.7850 | $284,178.4965 |
| 1000+ | $2,678.4640 | $1,339,231.9950 |
| 10000+ | $2,449.8146 | $2,449,814.6250 |
| The price is for reference only, please refer to the actual quotation! | ||