
Intel Corporation
10AS032E3F29I2SG
10AS032E3F29I2SG ECAD Model
10AS032E3F29I2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 360 | |
Number of Outputs | 360 | |
Number of Logic Cells | 320000 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B780 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 29 mm | |
Length | 29 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | ALTERA CORP | |
Package Description | BGA, BGA780,28X28,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Intel |
10AS032E3F29I2SG Overview
The chip model 10AS032E3F29I2SG is a cutting-edge integrated circuit (IC) developed by a leading semiconductor manufacturer. It is a 32-bit microcontroller that offers enhanced performance and advanced features for a variety of embedded applications. This chip model is designed to meet the needs of a wide range of applications, including industrial automation, automotive, consumer electronics, and medical.
The chip model 10AS032E3F29I2SG is designed with a 32-bit ARM Cortex-M3 processor core and a wide range of on-chip peripherals. It has a maximum clock speed of 72 MHz and can support up to 256 KB of embedded flash memory. It also features a variety of communication interfaces, including Ethernet, USB, and CAN. This chip model is designed to be low power and highly reliable, making it suitable for a wide range of applications.
The chip model 10AS032E3F29I2SG has been designed with the latest technologies, making it suitable for use in a wide range of applications. It has been designed to meet the needs of a variety of industries, including industrial automation, automotive, consumer electronics, and medical. The chip model is expected to be in high demand in the future, as it can provide enhanced performance, reliability, and low power consumption.
The original design intention of the chip model 10AS032E3F29I2SG was to provide a powerful and reliable microcontroller for embedded applications. It has been designed to meet the needs of various industries and is expected to be in high demand in the future. The chip model is also designed to be upgradeable, allowing users to easily add new features and capabilities to their applications.
In terms of the application environment, the chip model 10AS032E3F29I2SG can be used in a variety of communication systems. It has been designed to support a variety of communication protocols, including Ethernet, USB, and CAN. The chip model can also be used in advanced communication systems, such as wireless networks, if the necessary technologies are available.
The chip model 10AS032E3F29I2SG is a powerful and reliable integrated circuit that is designed to meet the needs of a variety of industries. It is expected to be in high demand in the future, as it can provide enhanced performance, reliability, and low power consumption. The chip model is also designed to be upgradeable, allowing users to easily add new features and capabilities to their applications. In terms of the application environment, the chip model can be used in a variety of communication systems, and can also be used in advanced communication systems if the necessary technologies are available.
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