10AS032E3F29I2SG
10AS032E3F29I2SG
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rohs

Intel Corporation

10AS032E3F29I2SG


10AS032E3F29I2SG
F18-10AS032E3F29I2SG
Active
IC SOC CORTEX-A9 1.5GHZ 780FBGA
780-FBGA, FC (29x29)

10AS032E3F29I2SG ECAD Model


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10AS032E3F29I2SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 900 mV
Number of Inputs 360
Number of Outputs 360
Number of Logic Cells 320000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B780
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 29 mm
Length 29 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer ALTERA CORP
Package Description BGA, BGA780,28X28,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Samacsys Manufacturer Intel

10AS032E3F29I2SG Overview



The chip model 10AS032E3F29I2SG is a cutting-edge integrated circuit (IC) developed by a leading semiconductor manufacturer. It is a 32-bit microcontroller that offers enhanced performance and advanced features for a variety of embedded applications. This chip model is designed to meet the needs of a wide range of applications, including industrial automation, automotive, consumer electronics, and medical.


The chip model 10AS032E3F29I2SG is designed with a 32-bit ARM Cortex-M3 processor core and a wide range of on-chip peripherals. It has a maximum clock speed of 72 MHz and can support up to 256 KB of embedded flash memory. It also features a variety of communication interfaces, including Ethernet, USB, and CAN. This chip model is designed to be low power and highly reliable, making it suitable for a wide range of applications.


The chip model 10AS032E3F29I2SG has been designed with the latest technologies, making it suitable for use in a wide range of applications. It has been designed to meet the needs of a variety of industries, including industrial automation, automotive, consumer electronics, and medical. The chip model is expected to be in high demand in the future, as it can provide enhanced performance, reliability, and low power consumption.


The original design intention of the chip model 10AS032E3F29I2SG was to provide a powerful and reliable microcontroller for embedded applications. It has been designed to meet the needs of various industries and is expected to be in high demand in the future. The chip model is also designed to be upgradeable, allowing users to easily add new features and capabilities to their applications.


In terms of the application environment, the chip model 10AS032E3F29I2SG can be used in a variety of communication systems. It has been designed to support a variety of communication protocols, including Ethernet, USB, and CAN. The chip model can also be used in advanced communication systems, such as wireless networks, if the necessary technologies are available.


The chip model 10AS032E3F29I2SG is a powerful and reliable integrated circuit that is designed to meet the needs of a variety of industries. It is expected to be in high demand in the future, as it can provide enhanced performance, reliability, and low power consumption. The chip model is also designed to be upgradeable, allowing users to easily add new features and capabilities to their applications. In terms of the application environment, the chip model can be used in a variety of communication systems, and can also be used in advanced communication systems if the necessary technologies are available.



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