Intel Corporation
10AS032E2F29E2LG
10AS032E2F29E2LG ECAD Model
10AS032E2F29E2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 320000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA780,28X28,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AS032E2F29E2LG Overview
The chip model 10AS032E2F29E2LG is a highly advanced integrated circuit that has been developed to meet the needs of a variety of industries. It is a powerful tool for engineers, designers, and researchers to build a wide range of products and applications. The chip model is based on the advanced technologies of System-on-Chip (SoC) and Application-Specific Integrated Circuit (ASIC) design. Its advanced features include high-speed signal processing, low-power consumption, and high-density memory.
In terms of industry trends, the chip model 10AS032E2F29E2LG is expected to become increasingly popular in the coming years. This is due to its ability to support a wide range of applications, from communication systems to robotics. Furthermore, its advanced technologies make it ideal for applications in advanced communication systems, such as 5G, which require high-speed signal processing and low-power consumption.
Regarding the future development of the chip model 10AS032E2F29E2LG, the possibilities are endless. The chip model can be upgraded with new features and technologies, such as artificial intelligence and machine learning, to further enhance its performance. It can also be used in the development and popularization of future intelligent robots, making it an important tool for engineers and researchers.
In order to use the chip model 10AS032E2F29E2LG effectively, technical talents are needed to understand its capabilities and limitations. They should be familiar with the latest technologies, such as artificial intelligence, machine learning, and signal processing, in order to make the most of the chip model. Furthermore, they should be able to identify the application environment that requires the support of new technologies and upgrade the chip model accordingly.
Overall, the chip model 10AS032E2F29E2LG is a powerful and versatile tool that has the potential to revolutionize the development of a wide range of applications. Its advanced technologies make it ideal for communication systems and robotics, while its upgradability ensures that it can keep up with the latest trends and technologies. With the right technical talents, the chip model can be used to its full potential, making it an invaluable tool for engineers and researchers.
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5,362 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6,250.0250 | $6,250.0250 |
| 10+ | $6,182.8204 | $61,828.2044 |
| 100+ | $5,846.7976 | $584,679.7590 |
| 1000+ | $5,510.7747 | $2,755,387.3700 |
| 10000+ | $5,040.3428 | $5,040,342.7500 |
| The price is for reference only, please refer to the actual quotation! | ||