10AS032E2F29E1SG
10AS032E2F29E1SG
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rohs

Intel Corporation

10AS032E2F29E1SG


10AS032E2F29E1SG
F18-10AS032E2F29E1SG
Active
IC SOC CORTEX-A9 1.5GHZ 780FBGA
780-FBGA, FC (29x29)

10AS032E2F29E1SG ECAD Model


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10AS032E2F29E1SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 900 mV
Number of Inputs 360
Number of Outputs 360
Number of Logic Cells 320000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B780
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 29 mm
Length 29 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer ALTERA CORP
Package Description BGA, BGA780,28X28,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AS032E2F29E1SG Overview



The chip model 10AS032E2F29E1SG is a highly advanced and powerful chip that is suitable for a variety of applications such as high-performance digital signal processing, embedded processing, and image processing. It requires the use of the HDL language to program it, making it a great choice for developers looking to harness the power of this chip.


The industry trends of the chip model 10AS032E2F29E1SG are constantly evolving and the future development of related industries is likely to be heavily dependent on the specific technologies that are needed. For example, if the application environment requires the support of new technologies, then the chip model 10AS032E2F29E1SG may be able to provide the necessary support.


When it comes to the application of the chip model 10AS032E2F29E1SG to the development and popularization of future intelligent robots, the chip model 10AS032E2F29E1SG is certainly capable of providing the necessary support. However, the technical talents that are needed to use the chip model 10AS032E2F29E1SG effectively will depend on the specific application. For example, if the application requires the use of artificial intelligence, then the developers will need to have expertise in AI programming.


In conclusion, the chip model 10AS032E2F29E1SG is a powerful tool that can be used for a variety of applications. The industry trends and future development of related industries will depend on the specific technologies that are needed. Additionally, the chip model 10AS032E2F29E1SG can be used to develop and popularize future intelligent robots, but the technical talents that are needed to use the chip model 10AS032E2F29E1SG effectively will depend on the specific application.



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