10AS027E3F29I2SG
10AS027E3F29I2SG
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rohs

Intel Corporation

10AS027E3F29I2SG


10AS027E3F29I2SG
F18-10AS027E3F29I2SG
Active
IC SOC CORTEX-A9 1.5GHZ 780FBGA
780-FBGA, FC (29x29)

10AS027E3F29I2SG ECAD Model


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10AS027E3F29I2SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 900 mV
Number of Inputs 360
Number of Outputs 360
Number of Logic Cells 270000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B780
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 29 mm
Length 29 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer ALTERA CORP
Package Description BGA, BGA780,28X28,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Samacsys Manufacturer Intel

10AS027E3F29I2SG Overview



Chip model 10AS027E3F29I2SG is a highly advanced chip that has been designed to provide users with a number of benefits. It is a low-power, low-cost chip that is perfect for a variety of applications. It is designed to be highly efficient, providing users with a high degree of performance at a low cost. It is also designed to be extremely reliable, with a very low failure rate.


The chip model 10AS027E3F29I2SG is expected to have a high demand in the future, particularly in the fields of communication and networking. The chip is capable of supporting a wide range of communication protocols, including the latest 5G networks. It is also capable of supporting a variety of intelligent scenarios, such as voice recognition, facial recognition, and machine learning. This makes it an ideal chip for use in the development of fully intelligent systems.


The original design intention of the chip model 10AS027E3F29I2SG was to provide users with a highly efficient and reliable chip that could be used in a variety of applications. The chip is designed to be highly efficient, providing users with a high degree of performance at a low cost. It is also designed to be extremely reliable, with a very low failure rate. The chip is also designed to be easily upgradeable, allowing users to take advantage of new technologies and features as they become available.


The chip model 10AS027E3F29I2SG may be applied to a variety of networks and intelligent scenarios in the future. It is capable of supporting a wide range of communication protocols, including the latest 5G networks. It is also capable of supporting a variety of intelligent scenarios, such as voice recognition, facial recognition, and machine learning. This makes it an ideal chip for use in the development of fully intelligent systems.


In conclusion, chip model 10AS027E3F29I2SG is a highly advanced chip that has been designed to provide users with a number of benefits. It is expected to have a high demand in the future, particularly in the fields of communication and networking. The chip is designed to be highly efficient, providing users with a high degree of performance at a low cost. It is also designed to be easily upgradeable, allowing users to take advantage of new technologies and features as they become available. Finally, the chip is capable of being applied to a variety of networks and intelligent scenarios in the future, making it an ideal chip for use in the development of fully intelligent systems.



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Unit Price: $4,182.3188
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,889.5565 $3,889.5565
10+ $3,847.7333 $38,477.3330
100+ $3,638.6174 $363,861.7356
1000+ $3,429.5014 $1,714,750.7080
10000+ $3,136.7391 $3,136,739.1000
The price is for reference only, please refer to the actual quotation!

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