
Altera Corporation
EPM7512BBI256-7
EPM7512BBI256-7 ECAD Model
EPM7512BBI256-7 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 7.5 ns | |
Number of Macro Cells | 512 | |
Number of I/O Lines | 212 | |
Programmable Logic Type | EE PLD | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 0 DEDICATED INPUTS, 212 I/O | |
Additional Feature | YES | |
Clock Frequency-Max | 119 MHz | |
In-System Programmable | YES | |
JTAG BST | YES | |
Output Function | MACROCELL | |
Power Supplies | 1.8/3.3,2.5 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 220 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,20X20,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | BGA | |
Package Description | LBGA, BGA256,20X20,50 | |
Pin Count | 256 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
EPM7512BBI256-7 Datasheet Download
EPM7512BBI256-7 Overview
The EPM7512BBI256-7 chip model is a high-performance, low-power, and cost-effective programmable logic device (PLD) that is suitable for use in a variety of digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL (Hardware Description Language) and requires the use of HDL language for programming.
The EPM7512BBI256-7 chip model can be used in a wide range of networks and intelligent scenarios. It is a great choice for developing intelligent systems and networks, as it has the capability to handle high-speed data processing and image processing tasks. It can be used in the era of fully intelligent systems, as it is capable of handling complex tasks with its powerful architecture.
The product description of the EPM7512BBI256-7 chip model is available on the vendor's website. It provides detailed information about the chip's features and capabilities, along with design requirements and actual case studies. It is important to note that the chip model requires a high level of expertise and experience in HDL programming and design. It is also important to follow the vendor's design guidelines and safety precautions when using the chip model.
In conclusion, the EPM7512BBI256-7 chip model is a great choice for a variety of digital signal processing, embedded processing, and image processing applications. It is capable of handling complex tasks and can be used in the era of fully intelligent systems. It is important to follow the vendor's design guidelines and safety precautions when using the chip model, as it requires a high level of expertise and experience in HDL programming and design.
You May Also Be Interested In
5,023 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
No reference price found. |