EPM7512BBI256-7
EPM7512BBI256-7
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Altera Corporation

EPM7512BBI256-7


EPM7512BBI256-7
F53-EPM7512BBI256-7
Active
EE PLD, 7.5 ns, 512-Cell, CMOS, LBGA, BGA256,20X20,50
LBGA, BGA256,20X20,50

EPM7512BBI256-7 ECAD Model


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EPM7512BBI256-7 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 7.5 ns
Number of Macro Cells 512
Number of I/O Lines 212
Programmable Logic Type EE PLD
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 212 I/O
Additional Feature YES
Clock Frequency-Max 119 MHz
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 1.8/3.3,2.5 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 220
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,20X20,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description LBGA, BGA256,20X20,50
Pin Count 256
Reach Compliance Code unknown
HTS Code 8542.39.00.01
ECCN Code 3A991.D

EPM7512BBI256-7 Datasheet Download


EPM7512BBI256-7 Overview



The EPM7512BBI256-7 chip model is a high-performance, low-power, and cost-effective programmable logic device (PLD) that is suitable for use in a variety of digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL (Hardware Description Language) and requires the use of HDL language for programming.


The EPM7512BBI256-7 chip model can be used in a wide range of networks and intelligent scenarios. It is a great choice for developing intelligent systems and networks, as it has the capability to handle high-speed data processing and image processing tasks. It can be used in the era of fully intelligent systems, as it is capable of handling complex tasks with its powerful architecture.


The product description of the EPM7512BBI256-7 chip model is available on the vendor's website. It provides detailed information about the chip's features and capabilities, along with design requirements and actual case studies. It is important to note that the chip model requires a high level of expertise and experience in HDL programming and design. It is also important to follow the vendor's design guidelines and safety precautions when using the chip model.


In conclusion, the EPM7512BBI256-7 chip model is a great choice for a variety of digital signal processing, embedded processing, and image processing applications. It is capable of handling complex tasks and can be used in the era of fully intelligent systems. It is important to follow the vendor's design guidelines and safety precautions when using the chip model, as it requires a high level of expertise and experience in HDL programming and design.



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