EPM7512BBC256-10N
EPM7512BBC256-10N
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rohs

Altera Corporation

EPM7512BBC256-10N


EPM7512BBC256-10N
F53-EPM7512BBC256-10N
Active
EE PLD, 5.5 ns, 512-Cell, CMOS, LBGA, BGA256,20X20,50
LBGA, BGA256,20X20,50

EPM7512BBC256-10N ECAD Model


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EPM7512BBC256-10N Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 2.5 V
Propagation Delay 5.5 ns
Number of Macro Cells 512
Number of I/O Lines 212
Programmable Logic Type EE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 212 I/O
Additional Feature YES
Clock Frequency-Max 163.9 MHz
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 1.8/3.3,2.5 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Operating Temperature-Max 70 °C
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,20X20,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description LBGA, BGA256,20X20,50
Pin Count 256
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

EPM7512BBC256-10N Datasheet Download


EPM7512BBC256-10N Overview



The chip model EPM7512BBC256-10N is a high-performance, low-power, and cost-effective FPGA device. It has been widely used in various industries, such as automotive, avionics, industrial, medical, and consumer electronics. It has the advantages of low power consumption, high performance, and reliability. With the rapid development of related industries, the demand for this chip model is also increasing.


To better understand the industry trends of the chip model EPM7512BBC256-10N and the future development of related industries, it is necessary to take a closer look at its product description and specific design requirements. The chip model EPM7512BBC256-10N has a 32-bit RISC-V CPU core, 256KB embedded flash memory, 32KB SRAM, and 4KB EEPROM. It also supports various system interfaces such as GPIO, UART, SPI, I2C, and CAN. It is capable of providing high-speed data processing, low-power operation, and reliable operation.


In terms of the application environment, the chip model EPM7512BBC256-10N can be used in a variety of applications, including automotive, avionics, industrial, medical, and consumer electronics. For example, it can be used in automotive applications for advanced driver assistance systems (ADAS), in avionics systems for aircraft control, in industrial applications for factory automation, in medical applications for medical imaging, and in consumer electronics for smart home appliances.


In order to ensure the successful application of the chip model EPM7512BBC256-10N, it is important to consider the specific design requirements. For example, the design should consider the power consumption, the system reliability, the system performance, and the system scalability. It is also important to consider the system integration, the system compatibility, the system security, and the system optimization. Moreover, it is necessary to consider the actual case studies and the precautions for the application environment.


In conclusion, the chip model EPM7512BBC256-10N is a high-performance, low-power, and cost-effective FPGA device. It has been widely used in various industries, and with the rapid development of related industries, the demand for this chip model is also increasing. In order to ensure the successful application of the chip model EPM7512BBC256-10N, it is important to consider the specific design requirements, the actual case studies, and the precautions for the application environment.



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