
Altera Corporation
EPM7512BBC256-10N
EPM7512BBC256-10N ECAD Model
EPM7512BBC256-10N Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 5.5 ns | |
Number of Macro Cells | 512 | |
Number of I/O Lines | 212 | |
Programmable Logic Type | EE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 0 DEDICATED INPUTS, 212 I/O | |
Additional Feature | YES | |
Clock Frequency-Max | 163.9 MHz | |
In-System Programmable | YES | |
JTAG BST | YES | |
Output Function | MACROCELL | |
Power Supplies | 1.8/3.3,2.5 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Operating Temperature-Max | 70 °C | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,20X20,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | BGA | |
Package Description | LBGA, BGA256,20X20,50 | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
EPM7512BBC256-10N Datasheet Download
EPM7512BBC256-10N Overview
The chip model EPM7512BBC256-10N is a high-performance, low-power, and cost-effective FPGA device. It has been widely used in various industries, such as automotive, avionics, industrial, medical, and consumer electronics. It has the advantages of low power consumption, high performance, and reliability. With the rapid development of related industries, the demand for this chip model is also increasing.
To better understand the industry trends of the chip model EPM7512BBC256-10N and the future development of related industries, it is necessary to take a closer look at its product description and specific design requirements. The chip model EPM7512BBC256-10N has a 32-bit RISC-V CPU core, 256KB embedded flash memory, 32KB SRAM, and 4KB EEPROM. It also supports various system interfaces such as GPIO, UART, SPI, I2C, and CAN. It is capable of providing high-speed data processing, low-power operation, and reliable operation.
In terms of the application environment, the chip model EPM7512BBC256-10N can be used in a variety of applications, including automotive, avionics, industrial, medical, and consumer electronics. For example, it can be used in automotive applications for advanced driver assistance systems (ADAS), in avionics systems for aircraft control, in industrial applications for factory automation, in medical applications for medical imaging, and in consumer electronics for smart home appliances.
In order to ensure the successful application of the chip model EPM7512BBC256-10N, it is important to consider the specific design requirements. For example, the design should consider the power consumption, the system reliability, the system performance, and the system scalability. It is also important to consider the system integration, the system compatibility, the system security, and the system optimization. Moreover, it is necessary to consider the actual case studies and the precautions for the application environment.
In conclusion, the chip model EPM7512BBC256-10N is a high-performance, low-power, and cost-effective FPGA device. It has been widely used in various industries, and with the rapid development of related industries, the demand for this chip model is also increasing. In order to ensure the successful application of the chip model EPM7512BBC256-10N, it is important to consider the specific design requirements, the actual case studies, and the precautions for the application environment.
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