Altera Corporation
EPF8820GI192-3
EPF8820GI192-3 ECAD Model
EPF8820GI192-3 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 152 | |
| Number of Outputs | 148 | |
| Number of Logic Cells | 672 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 148 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 148 I/O | |
| Additional Feature | 820 FLIP FLOPS; 672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION - 3.3V OR 5V | |
| Output Function | REGISTERED | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-CPGA-P192 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 192 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA192,17X17 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 45.15 mm | |
| Length | 45.15 mm | |
| Seated Height-Max | 5.43 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA192,17X17 | |
| Pin Count | 192 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
EPF8820GI192-3 Datasheet Download
EPF8820GI192-3 Overview
The chip model EPF8820GI192-3 is a high-performance digital signal processor (DSP) designed for embedded processing, image processing and other applications. It is based on the RISC-V architecture, which is a high-performance, low-cost, and low-power processor designed to meet the needs of embedded and mobile applications. The EPF8820GI192-3 features a 192-bit wide internal data bus, and it is capable of executing instructions up to 4 times faster than the previous generation of processors. It is also capable of executing instructions up to 8 times faster than the earlier generation of processors. The chip model is also capable of running a wide range of applications, including image processing, digital signal processing, and embedded processing.
The original design intention of the EPF8820GI192-3 was to provide a low-cost, high-performance processor for embedded and mobile applications. It is designed to be compatible with the HDL language, which is the standard language used for programming digital signal processors. This makes it easier for developers to create new applications and to upgrade existing applications. The chip model also has the ability to be upgraded in the future, allowing it to be used in more advanced applications.
The EPF8820GI192-3 can be used in a variety of network applications, such as wireless sensor networks, wireless communication systems, and cellular networks. It is also suitable for use in intelligent systems, such as autonomous vehicles, robotics, and artificial intelligence. The chip model is capable of executing instructions at a high speed, making it suitable for real-time applications. The chip model is also capable of running a wide range of applications, including image processing, digital signal processing, and embedded processing.
The EPF8820GI192-3 is a powerful processor that can be used in the era of fully intelligent systems. It is capable of running applications that require real-time execution, and it can be used for advanced communication systems. The chip model is also capable of running a wide range of applications, including image processing, digital signal processing, and embedded processing. This makes it suitable for use in a variety of intelligent scenarios, such as autonomous vehicles, robotics, and artificial intelligence. The chip model is also capable of being upgraded in the future, allowing it to be used in more advanced applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||