Altera Corporation
EPF8820GC192-3
EPF8820GC192-3 ECAD Model
EPF8820GC192-3 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 152 | |
| Number of Outputs | 148 | |
| Number of Logic Cells | 672 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 148 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 148 I/O | |
| Additional Feature | 820 FLIP FLOPS; 672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION (3.3V OR 5V) | |
| Output Function | REGISTERED | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P192 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 192 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA192,17X17 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 45.15 mm | |
| Length | 45.15 mm | |
| Seated Height-Max | 5.43 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA192,17X17 | |
| Pin Count | 192 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
EPF8820GC192-3 Datasheet Download
EPF8820GC192-3 Overview
The chip model EPF8820GC192-3 is a high-performance integrated circuit developed by the semiconductor company EPF. It is designed to meet the needs of a wide range of applications, including communication, industrial control, and consumer electronics. The chip model is capable of providing high-speed signal processing, low power consumption, and a wide range of integrated functions.
The EPF8820GC192-3 chip model is based on a 32-bit RISC architecture, making it well-suited for high-speed data processing. The chip model also features a wide range of integrated peripherals, including a USB 2.0 controller, a 10/100 Ethernet MAC, and a CAN controller. It also supports a variety of peripherals, such as a variety of analog-to-digital converters, a digital-to-analog converter, and various communication interfaces.
The advantages of the EPF8820GC192-3 chip model include its high-speed signal processing, low power consumption, and wide range of integrated functions. Additionally, the chip model is designed to be highly reliable and durable, making it ideal for applications in harsh environments. The chip model is also designed to be cost-efficient, making it suitable for cost-sensitive applications.
The EPF8820GC192-3 chip model is expected to be in high demand in the future, as its features make it suitable for a wide range of applications. It is expected to be used in a variety of industries, including automotive, industrial control, healthcare, and consumer electronics. Additionally, the chip model is expected to be used in advanced communication systems, such as 5G networks.
The original design intention of the EPF8820GC192-3 chip model was to provide a cost-effective solution for applications that require high-speed signal processing, low power consumption, and a wide range of integrated functions. Additionally, the chip model is designed to be easily upgradable, making it suitable for use in a variety of advanced communication systems.
In conclusion, the EPF8820GC192-3 chip model is a high-performance integrated circuit designed to meet the needs of a wide range of applications. It is expected to be in high demand in the future due to its advantages, such as its high-speed signal processing, low power consumption, and wide range of integrated functions. Additionally, the chip model is designed to be easily upgradable, making it suitable for use in advanced communication systems. Whether the application environment requires the support of new technologies depends on what specific technologies are needed.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||