Altera Corporation
EPF10K70GC503-4
EPF10K70GC503-4 ECAD Model
EPF10K70GC503-4 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 700 ps | |
| Number of Inputs | 358 | |
| Number of Outputs | 358 | |
| Number of Logic Cells | 3744 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 358 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 358 I/O | |
| Additional Feature | 3744 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | |
| Clock Frequency-Max | 49 MHz | |
| Output Function | REGISTERED | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P503 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 503 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | IPGA | |
| Package Equivalence Code | SPGA503,43X43 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, INTERSTITIAL PITCH | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 57.4 mm | |
| Length | 57.4 mm | |
| Seated Height-Max | 5.077 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | PGA | |
| Package Description | IPGA, SPGA503,43X43 | |
| Pin Count | 503 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K70GC503-4 Datasheet Download
EPF10K70GC503-4 Overview
The chip model EPF10K70GC503-4 is a powerful and versatile processor designed for high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be used with HDL language, which is a powerful language for programming digital circuits. This chip model is suitable for a wide range of applications, including communication systems, medical devices, and automotive systems.
The industry trends of the chip model EPF10K70GC503-4 and the future development of related industries are largely dependent on the specific technologies needed for the application environment. In order to ensure that the chip model is up to date and able to keep up with the industry trends, it is important to keep up with the latest technologies and ensure that the chip model is compatible with them.
The original design intention of the chip model EPF10K70GC503-4 was to provide a powerful processor for high-performance applications. The chip was designed to be able to handle complex tasks, such as image processing and embedded processing, in a more efficient manner. Additionally, the chip was designed to be able to keep up with the latest technologies available, so that it can remain relevant and useful in the future.
The possibility of future upgrades and whether the chip model can be applied to advanced communication systems depends on the specific technologies needed. If the application environment requires the support of new technologies, then the chip model can be upgraded to meet the needs of the application. Additionally, the chip model can be applied to advanced communication systems as long as the necessary technologies are available.
You May Also Be Interested In
4,734 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||