EPF10K100GC503-4
EPF10K100GC503-4
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rohs

Altera Corporation

EPF10K100GC503-4


EPF10K100GC503-4
F53-EPF10K100GC503-4
Active
LOADABLE PLD, 700 ps, CMOS, IPGA, SPGA503,43X43
IPGA, SPGA503,43X43

EPF10K100GC503-4 ECAD Model


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EPF10K100GC503-4 Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Propagation Delay 700 ps
Number of Inputs 406
Number of Outputs 406
Number of Logic Cells 4992
Number of Dedicated Inputs 4
Number of I/O Lines 406
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 4 DEDICATED INPUTS, 406 I/O
Additional Feature 4992 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max 49 MHz
Output Function REGISTERED
Power Supplies 3.3/5,5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-CPGA-P503
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 1
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 220
Number of Terminals 503
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code IPGA
Package Equivalence Code SPGA503,43X43
Package Shape SQUARE
Package Style GRID ARRAY, INTERSTITIAL PITCH
Surface Mount NO
Terminal Finish TIN LEAD
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Width 57.4 mm
Length 57.4 mm
Seated Height-Max 5.077 mm
Ihs Manufacturer ALTERA CORP
Part Package Code PGA
Package Description IPGA, SPGA503,43X43
Pin Count 503
Reach Compliance Code unknown
ECCN Code 3A991.D
HTS Code 8542.39.00.01

EPF10K100GC503-4 Datasheet Download


EPF10K100GC503-4 Overview



The chip model EPF10K100GC503-4 is a powerful and versatile integrated circuit developed by Altera, a leading provider of programmable logic solutions. It is designed to provide a high-performance and cost-effective solution for complex logic designs. It has been widely used in a variety of applications, including communications, industrial automation, medical, and consumer electronics.


The EPF10K100GC503-4 chip model has several advantages over other integrated circuits. It is highly reliable and has a wide operating temperature range of -40°C to +85°C. It also has a high-speed capability of up to 500MHz and a low-power consumption of only 0.7W. It also offers a high integration level with up to 100K logic elements and an embedded memory of up to 10K bits. Furthermore, the chip model is designed to be compatible with industry-standard FPGA architectures, making it easy to integrate into existing designs.


The EPF10K100GC503-4 chip model is expected to experience increasing demand in the future. This is due to its ability to provide a cost-effective solution for complex logic designs and its compatibility with industry-standard FPGA architectures. It is also expected to be used in a variety of applications, including industrial automation, medical, and consumer electronics. Furthermore, as the demand for advanced communication systems increases, the chip model is expected to be used in these systems as well.


The original design intention of the chip model EPF10K100GC503-4 was to provide a cost-effective and reliable solution for complex logic designs. However, it is possible that the chip model may be upgraded in the future to include additional features such as higher speed, lower power consumption, and more embedded memory. This would open up the possibility of using the chip model in more advanced communication systems.


The EPF10K100GC503-4 chip model can also be applied to intelligent networks and scenarios. It can be used to enable intelligent automation, such as in industrial applications. It can also be used to enable intelligent consumer electronics, such as smart home appliances. Furthermore, it can be used to enable intelligent communication systems, such as 5G networks. In the future, it is possible that the chip model could be used in fully intelligent systems, such as artificial intelligence and machine learning.


In conclusion, the EPF10K100GC503-4 chip model is a powerful and reliable integrated circuit that is expected to experience increasing demand in the future. It is designed to provide a cost-effective and reliable solution for complex logic designs and is compatible with industry-standard FPGA architectures. It is also possible that the chip model may be upgraded in the future to include additional features. Furthermore, the chip model can be applied to intelligent networks and scenarios, and it is possible that it could be used in fully intelligent systems in the future.



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