AMD Xilinx
XQVR1000-4CG560V
XQVR1000-4CG560V ECAD Model
XQVR1000-4CG560V Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 1124022 | |
| Number of CLBs | 6144 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 1124022 GATES | |
| Power Supplies | 1.5/3.3,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-CBGA-X560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Total Dose | 100k Rad(Si) V | |
| Number of Terminals | 560 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HCGA | |
| Package Equivalence Code | CGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | UNSPECIFIED | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 4.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | CGA | |
| Package Description | HEAT SINK, CERAMIC, CGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQVR1000-4CG560V Datasheet Download
XQVR1000-4CG560V Overview
The chip model XQVR1000-4CG560V is a powerful and versatile processor designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is built to use the HDL language, which is the de facto standard for advanced digital circuit design and programming. This makes it an ideal choice for applications that require high-speed processing, such as advanced communication systems.
The original design intention of the chip model XQVR1000-4CG560V was to provide a powerful, yet cost-effective solution for digital signal and image processing. It is designed to be scalable, allowing for future upgrades to increase its performance and capabilities. This makes it an excellent choice for applications that require high-speed, reliable processing, such as advanced communication systems.
The chip model XQVR1000-4CG560V can also be applied to a variety of intelligent scenarios. It can be used to power networks, allowing for faster and more reliable communication. It can also be used to power intelligent systems, such as self-driving cars and smart home systems. In the era of fully intelligent systems, the chip model XQVR1000-4CG560V is an ideal choice for powering the most advanced applications.
Overall, the chip model XQVR1000-4CG560V is an excellent choice for digital signal and image processing applications. With its ability to use the HDL language and its scalability, it is an ideal choice for advanced communication systems. It can also be applied to a variety of intelligent scenarios, making it a great choice for the era of fully intelligent systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||