AMD Xilinx
XQV600-4HQ240N
XQV600-4HQ240N ECAD Model
XQV600-4HQ240N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 166 | |
| Number of Outputs | 166 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 661111 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-PRF-38535 | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 661111 GATES | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Equivalence Code | HQFP240,1.37SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, HQFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQV600-4HQ240N Datasheet Download
XQV600-4HQ240N Overview
XQV600-4HQ240N is a high-performance chip model designed for digital signal processing, embedded processing, and image processing. It is suitable for applications such as high-end communication systems, allowing users to access a wide range of features. The chip model is designed to use the HDL (Hardware Description Language) to make it easier for users to program and debug.
The XQV600-4HQ240N has been designed with a focus on high-performance and scalability. It has the ability to upgrade to a higher speed and performance level, making it suitable for advanced communication systems. It also features a wide range of features, including a high-performance processor, a large memory capacity, and a wide range of I/O ports.
The product description of the XQV600-4HQ240N includes an overview of the chip model, its features, and its design requirements. The design requirements include the use of HDL language, the use of high-performance processors, and the use of high-speed memory. The design also includes the use of I/O ports for external communication, as well as the use of high-speed buses for data transfer.
In order to ensure that the XQV600-4HQ240N meets the design requirements, actual case studies and precautions should be taken into account. For instance, when using the chip model for image processing, it is important to consider the memory requirements and the speed of the processor. Additionally, when using the chip model for embedded processing, it is important to consider the size of the processor and the power consumption of the chip.
Overall, the XQV600-4HQ240N is a high-performance chip model that is suitable for a wide range of applications. It is designed to use the HDL language, making it easier for users to program and debug. Additionally, it has the ability to upgrade to a higher speed and performance level, making it suitable for advanced communication systems. Finally, when using the chip model, it is important to consider the memory requirements and the speed of the processor, as well as the size of the processor and the power consumption of the chip.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||