AMD Xilinx
XQV1000E-6CG560M
XQV1000E-6CG560M ECAD Model
XQV1000E-6CG560M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 1569178 | |
| Number of CLBs | 6144 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | 38535Q/M;38534H;883B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 1569178 GATES | |
| Clock Frequency-Max | 357.2 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-CBGA-X560 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 560 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | CGA | |
| Package Equivalence Code | CGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | UNSPECIFIED | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 4.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | CGA | |
| Package Description | CGA, CGA560,33X33,50 | |
| Pin Count | 560 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQV1000E-6CG560M Datasheet Download
XQV1000E-6CG560M Overview
The chip model XQV1000E-6CG560M is a powerful, advanced integrated circuit that has been designed to provide solutions for the most demanding applications. It is a single-chip solution designed to meet the industry’s highest performance requirements. It is designed to be highly reliable, energy-efficient, and cost-effective.
The XQV1000E-6CG560M chip model offers a wide range of advantages. It utilizes advanced technologies to provide superior performance, speed, and reliability. It is also capable of handling a wide range of data types and sizes, making it suitable for a variety of applications. Additionally, it is highly energy-efficient and cost-effective, making it an ideal choice for a variety of applications.
The chip model XQV1000E-6CG560M is expected to be in high demand in the future due to its advanced features and capabilities. It is expected to be used in a variety of industries, including telecommunications, automotive, aerospace, and medical. It is also expected to be used in the development of new networks and intelligent systems.
The product description of the XQV1000E-6CG560M chip model includes a range of features and capabilities. It is designed to be highly reliable, energy-efficient, and cost-effective. It is also designed to be able to handle a wide range of data types and sizes. Additionally, it is designed to be able to handle a variety of applications.
The chip model XQV1000E-6CG560M is expected to be used in networks and intelligent systems in the future. It is expected to be used in the development of new networks and intelligent systems, and it is also expected to be used in the era of fully intelligent systems. It is expected to be used in a variety of applications, including autonomous vehicles, robotics, and the Internet of Things (IoT).
Case studies and precautions should be taken when using the XQV1000E-6CG560M chip model. It is important to ensure that the chip is properly installed and configured to ensure optimal performance. Additionally, it is important to ensure that the chip is properly maintained and updated to ensure that it continues to perform optimally. Furthermore, it is important to ensure that the chip is used in accordance with its design requirements and specifications.
The XQV1000E-6CG560M chip model is a powerful, advanced integrated circuit that is designed to provide solutions for the most demanding applications. It offers a wide range of advantages and is expected to be in high demand in the future due to its advanced features and capabilities. It is expected to be used in a variety of applications, including networks and intelligent systems, and it is important to ensure that the chip is properly installed, configured, maintained, and updated to ensure optimal performance.
5,741 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||