
AMD Xilinx
XQV1000-4CG560M
XQV1000-4CG560M ECAD Model
XQV1000-4CG560M Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Inputs | 404 | |
Number of Outputs | 404 | |
Number of Logic Cells | 27648 | |
Number of Equivalent Gates | 1124022 | |
Number of CLBs | 6144 | |
Combinatorial Delay of a CLB-Max | 800 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Screening Level | MIL-PRF-38535 | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 6144 CLBS, 1124022 GATES | |
Power Supplies | 1.2/3.6,2.5 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-CBGA-X560 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Number of Terminals | 560 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | HCGA | |
Package Equivalence Code | CGA560,33X33,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | UNSPECIFIED | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 4.9 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | CGA | |
Package Description | CERAMIC, CGA-560 | |
Pin Count | 560 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.39.00.01 |
XQV1000-4CG560M Datasheet Download
XQV1000-4CG560M Overview
The XQV1000-4CG560M chip model is an advanced integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language used to program digital circuits. This chip model is suitable for a variety of applications, including networks, intelligent scenarios, and fully intelligent systems.
The XQV1000-4CG560M chip model is designed to provide the highest performance possible in digital signal processing, embedded processing, and image processing. It features a high-speed, low-power architecture that is optimized for multi-core and multi-threaded applications. The chip model also has a wide range of features, including a variety of analog and digital I/O ports, high-speed memory access, and advanced power management capabilities.
In terms of product design, the XQV1000-4CG560M chip model is designed to meet the needs of a variety of applications. The chip model is designed to provide a high-performance, low-power solution for a variety of applications, including those that require high-speed data transfer, high-speed memory access, and advanced power management. The chip model also features a variety of analog and digital I/O ports, as well as advanced power management features.
In terms of actual case studies and precautions, the XQV1000-4CG560M chip model has been successfully used in a variety of applications. For example, the chip model has been used in a variety of embedded systems, including those used in medical devices, security systems, and industrial automation systems. The chip model has also been successfully used in a variety of image processing applications, such as those used in surveillance systems and facial recognition systems.
When using the XQV1000-4CG560M chip model, it is important to take into account the specific design requirements of the chip. For example, the chip model must be designed to meet the specific needs of the application, including the power requirements, the memory requirements, and the I/O requirements. It is also important to take into account the specific requirements of the HDL language, as well as any specific design constraints that may be imposed by the application.
In conclusion, the XQV1000-4CG560M chip model is an advanced integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language used to program digital circuits. The chip model is suitable for a variety of applications, including networks, intelligent scenarios, and fully intelligent systems. In terms of product design, the XQV1000-4CG560M chip model is designed to provide a high-performance, low-power solution for a variety of applications. When using the XQV1000-4CG560M chip model, it is important to take into account the specific design requirements of the chip, as well as any specific design constraints that may be imposed by the application.
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