AMD Xilinx
XQR17V16CC44V
XQR17V16CC44V ECAD Model
XQR17V16CC44V Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 16.7772 Mbit | |
| Memory Width | 8 | |
| Organization | 2MX8 | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Power Supplies | 3.3 V | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 2000000 | |
| Number of Words | 2.0972 M | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | PARALLEL/SERIAL | |
| Standby Current-Max | 1 mA | |
| Supply Current-Max | 100 µA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| JESD-30 Code | S-CQCC-J44 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Total Dose | 50k Rad(Si) V | |
| Number of Terminals | 44 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC44,.7SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Seated Height-Max | 4.826 mm | |
| Length | 16.51 mm | |
| Width | 16.51 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | CERAMIC, LCC-44 | |
| Pin Count | 44 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Samacsys Manufacturer | XILINX |
XQR17V16CC44V Datasheet Download
XQR17V16CC44V Overview
The XQR17V16CC44V is a chip model that is suitable for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a hardware description language used to program the device. This chip model has the advantage of being able to process data quickly and accurately. It also has the ability to store large amounts of data, making it a powerful tool for data processing.
The XQR17V16CC44V chip model is expected to become increasingly popular in the future. As technology advances, more industries are turning to digital signal processing, embedded processing, and image processing to improve their processes and products. This chip model is well suited to these applications and will be in high demand as these industries continue to grow.
The XQR17V16CC44V chip model can be applied to the development and popularization of future intelligent robots. This chip model offers the processing power and data storage capacity needed to power these robots. In order to use the model effectively, technical talents such as engineers, computer scientists, and software developers are needed. These professionals must have an understanding of hardware description language and be able to program the chip model to meet the needs of the robot.
In conclusion, the XQR17V16CC44V chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is expected to be in high demand in the future as more industries turn to these technologies. It can also be applied to the development and popularization of future intelligent robots, and technical talents such as engineers, computer scientists, and software developers are needed to use the model effectively.
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2,320 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,860.0001 | $1,860.0001 |
| 10+ | $1,840.0001 | $18,400.0009 |
| 100+ | $1,740.0001 | $174,000.0087 |
| 1000+ | $1,640.0001 | $820,000.0410 |
| 10000+ | $1,500.0001 | $1,500,000.0750 |
| The price is for reference only, please refer to the actual quotation! | ||