XQ7K325T-2RF900I
XQ7K325T-2RF900I
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rohs

AMD Xilinx

XQ7K325T-2RF900I


XQ7K325T-2RF900I
F20-XQ7K325T-2RF900I
Active
FIELD PROGRAMMABLE GATE ARRAY, HKMG, 31 X 31 MM, 1 MM PITCH, FBGA-900
31 X 31 MM, 1 MM PITCH, FBGA-900

XQ7K325T-2RF900I ECAD Model


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XQ7K325T-2RF900I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 500
Number of Outputs 500
Number of Logic Cells 326080
Number of CLBs 25475
Combinatorial Delay of a CLB-Max 610 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology HKMG
Organization 25475 CLBS
Supply Voltage-Max 1.03 V
Supply Voltage-Min 970 mV
JESD-30 Code S-PBGA-B900
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 31 mm
Length 31 mm
Seated Height-Max 3.44 mm
Ihs Manufacturer XILINX INC
Package Description 31 X 31 MM, 1 MM PITCH, FBGA-900
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XQ7K325T-2RF900I Datasheet Download


XQ7K325T-2RF900I Overview



The XQ7K325T-2RF900I chip model is a high-performance digital signal processor (DSP) that is suitable for embedded processing, image processing, and other applications. It is designed to be programmed using the hardware description language (HDL) and is capable of performing complex calculations and operations.


The design intention of the XQ7K325T-2RF900I is to provide a reliable, high-performance solution for various applications. It is highly scalable and can be upgraded with additional components to meet specific requirements. It is also capable of being applied to advanced communication systems, making it an ideal choice for a wide range of projects.


The XQ7K325T-2RF900I chip model is designed to be a powerful, efficient processor with a wide range of features. It has a 32-bit RISC architecture, a 900 MHz clock frequency, and a wide range of memory and I/O options. It also supports a large number of peripherals, such as Ethernet, USB, and CAN bus.


In order to ensure successful implementation of the XQ7K325T-2RF900I, it is important to follow the product description and design requirements. This includes ensuring that the correct components are used, that the correct programming language is used, and that the correct peripherals are connected. Additionally, there are a number of precautions that should be taken when using the XQ7K325T-2RF900I, such as proper grounding and shielding.


There are numerous case studies that demonstrate the effectiveness of the XQ7K325T-2RF900I. These include applications such as image processing, motor control, and audio processing. These case studies provide valuable insights into the capabilities of the XQ7K325T-2RF900I and can be used to inform the design of projects.


In conclusion, the XQ7K325T-2RF900I chip model is a powerful, efficient processor that is suitable for a wide range of applications. It is designed to be programmed using the hardware description language (HDL) and is capable of performing complex calculations and operations. It is highly scalable and can be upgraded with additional components to meet specific requirements. Additionally, it can be applied to advanced communication systems, making it an ideal choice for a wide range of projects. It is important to follow the product description and design requirements and take the necessary precautions to ensure successful implementation.



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