AMD Xilinx
XQ7K325T-1RF900M
XQ7K325T-1RF900M ECAD Model
XQ7K325T-1RF900M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 500 | |
| Number of Outputs | 500 | |
| Number of Logic Cells | 326080 | |
| Number of CLBs | 25475 | |
| Combinatorial Delay of a CLB-Max | 740 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | HKMG | |
| Organization | 25475 CLBS | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B900 | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 3.44 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 31 X 31 MM, 1 MM PITCH, FBGA-900 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQ7K325T-1RF900M Datasheet Download
XQ7K325T-1RF900M Overview
The XQ7K325T-1RF900M chip model is a powerful and versatile chip that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL (Hardware Description Language) for programming, making it a great choice for engineers and developers looking to create sophisticated applications.
As technology advances, so too do the capabilities of the XQ7K325T-1RF900M chip model. It is already being used in a variety of networks and intelligent scenarios, and its potential applications in the future are only limited by the imagination. It is possible that this chip model could be used in the era of fully intelligent systems, as it is powerful enough to handle the demands of such systems.
The industry trends of the XQ7K325T-1RF900M chip model, and the future development of related industries, will depend on the specific technologies needed. For example, if new technologies such as artificial intelligence, machine learning, and advanced analytics are needed, then the XQ7K325T-1RF900M chip model could be used to power such applications.
In conclusion, the XQ7K325T-1RF900M chip model is a powerful and versatile chip that is suitable for a variety of applications, and its potential applications in the future are only limited by the imagination. It is possible that this chip model could be used in the era of fully intelligent systems, as it is powerful enough to handle the demands of such systems. The industry trends of the XQ7K325T-1RF900M chip model, and the future development of related industries, will depend on the specific technologies needed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||