AMD Xilinx
XQ7K325T-1RF900I
XQ7K325T-1RF900I ECAD Model
XQ7K325T-1RF900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 500 | |
| Number of Outputs | 500 | |
| Number of Logic Cells | 326080 | |
| Number of CLBs | 25475 | |
| Combinatorial Delay of a CLB-Max | 740 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | HKMG | |
| Organization | 25475 CLBS | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B900 | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 3.44 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 31 X 31 MM, 1 MM PITCH, FBGA-900 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XQ7K325T-1RF900I Datasheet Download
XQ7K325T-1RF900I Overview
The chip model XQ7K325T-1RF900I is an advanced technology developed by the leading semiconductor company XQ. It is a high-performance, low-power, and high-density chip model that is designed to be used in a variety of networks and intelligent scenarios. It is capable of providing high-speed data processing and communication, as well as being able to support a variety of complex applications.
The XQ7K325T-1RF900I chip model is designed for use in a range of intelligent scenarios, including artificial intelligence, machine learning, robotics, and other cutting-edge technological fields. It is capable of providing the necessary processing power and data communications to support the development and popularization of future intelligent robots. It is also capable of being used in the era of fully intelligent systems, as it is designed to be able to handle large amounts of data and complex tasks.
The product description of the XQ7K325T-1RF900I chip model includes a range of features, such as its high-speed processor, low-power consumption, and high-density design. It is capable of providing a high-speed data transmission rate, which makes it suitable for use in a range of intelligent scenarios. It is also designed to be able to handle large amounts of data and complex tasks, which makes it suitable for use in the era of fully intelligent systems.
In order to use the XQ7K325T-1RF900I chip model effectively, it is important to understand the specific design requirements and actual case studies associated with it. It is also important to take into consideration any potential risks and precautions that may be necessary when using the chip model. In addition, it is important to have the right technical talent in order to use the model effectively.
The XQ7K325T-1RF900I chip model is a cutting-edge technology that is designed to be used in a variety of networks and intelligent scenarios. It is capable of providing the necessary processing power and data communications to support the development and popularization of future intelligent robots, and is also capable of being used in the era of fully intelligent systems. It is important to understand the specific design requirements and actual case studies associated with the chip model, as well as any potential risks and precautions that may be necessary when using it. With the right technical talent, the XQ7K325T-1RF900I chip model can be used effectively to drive the development and popularization of future intelligent robots.
You May Also Be Interested In
3,155 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||