
AMD Xilinx
XQ7A50T-1FG484M
XQ7A50T-1FG484M ECAD Model
XQ7A50T-1FG484M Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 250 | |
Number of Outputs | 250 | |
Number of Logic Cells | 52160 | |
Number of CLBs | 4075 | |
Combinatorial Delay of a CLB-Max | 1.27 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | HKMG | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B484 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 484 | |
Package Body Material | PLASTIC | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.39.00.01 |
XQ7A50T-1FG484M Datasheet Download
XQ7A50T-1FG484M Overview
The chip model XQ7A50T-1FG484M is a powerful and reliable integrated circuit (IC) that has been gaining attention in the industry. It is a highly efficient, low-power device that is used in a variety of applications, including networks, intelligent systems, and more. With its advanced features and capabilities, it is becoming increasingly popular in the industry.
The XQ7A50T-1FG484M chip model is designed to be compatible with a wide range of technologies. It is capable of supporting the latest network protocols and standards, as well as providing a reliable and secure connection. It also has the ability to support a variety of intelligent systems, such as machine learning and artificial intelligence. This makes it an ideal choice for the future of networks and intelligent systems.
The XQ7A50T-1FG484M chip model also has a number of design features that make it a great choice for applications. It is designed with a low-power architecture, which helps to reduce power consumption and extend battery life. It also has a robust security system, which helps to protect data and networks from malicious attacks. Finally, it has a high-speed interface, which allows for faster data transmission and improved performance.
In addition to the features and capabilities of the XQ7A50T-1FG484M chip model, it is important to consider the product description and design requirements. It is important to understand the specific needs of the application and to choose a chip model that can meet those needs. It is also important to consider the environmental requirements of the application, as well as the potential risks and hazards associated with the use of the chip model.
Finally, it is important to consider actual case studies and precautions when using the XQ7A50T-1FG484M chip model. By understanding how the chip model has been used in the past, it is possible to identify potential issues and determine whether or not the chip model is suitable for the application. Additionally, it is important to consider any potential safety issues that may arise when using the chip model.
Overall, the XQ7A50T-1FG484M chip model is a powerful and reliable integrated circuit that is becoming increasingly popular in the industry. It is capable of supporting the latest network protocols and standards, as well as providing a reliable and secure connection. It is also designed with a low-power architecture, which helps to reduce power consumption and extend battery life. Additionally, it has a robust security system, which helps to protect data and networks from malicious attacks. Finally, it is important to consider the product description and design requirements, as well as actual case studies and precautions when using the chip model.
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