
AMD Xilinx
XQ7A50T-1CS325M
XQ7A50T-1CS325M ECAD Model
XQ7A50T-1CS325M Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 150 | |
Number of Outputs | 150 | |
Number of Logic Cells | 52160 | |
Number of CLBs | 4075 | |
Combinatorial Delay of a CLB-Max | 1.27 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | HKMG | |
Organization | 4075 CLBS | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B324 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Number of Terminals | 324 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA324,18X18,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 800 µm | |
Terminal Position | BOTTOM | |
Width | 15 mm | |
Length | 15 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A001.A.2.C | |
Package Description | CSBGA-325 |
XQ7A50T-1CS325M Datasheet Download
XQ7A50T-1CS325M Overview
The XQ7A50T-1CS325M chip model is a powerful and versatile processor designed for high-performance digital signal processing, embedded processing, and image processing. It is a highly integrated, low-power, single-chip solution that is suitable for a wide range of applications, from consumer electronics to industrial automation.
The XQ7A50T-1CS325M chip model is based on a 32-bit RISC architecture, with a maximum operating frequency of up to 1.25GHz. It is equipped with a range of peripherals, including two CAN buses, two UARTs, two SPI buses, two I2C buses, and two Ethernet MACs. Additionally, the model has an integrated FPGA, which allows for the use of HDL (Hardware Description Language) programming.
The XQ7A50T-1CS325M chip model is designed to meet the needs of the market for high-performance, low-power processors. It is expected to be in high demand in the near future, as the demand for powerful and efficient processors continues to grow. This chip model is suitable for a variety of applications, including industrial automation, consumer electronics, and communications systems.
The original design intention of the XQ7A50T-1CS325M chip model was to provide a powerful, yet low-power processor solution for a variety of applications. The model is highly integrated and can be used for a wide range of tasks, from digital signal processing to embedded processing and image processing. The model is also designed to be easily upgradable, allowing users to upgrade their processor as new technologies become available.
The XQ7A50T-1CS325M chip model is also suitable for use in advanced communication systems. It is equipped with two CAN buses, two UARTs, two SPI buses, two I2C buses, and two Ethernet MACs, making it ideal for a variety of communication protocols. Additionally, the integrated FPGA allows for the use of HDL programming, making it suitable for the development of advanced communication systems.
Overall, the XQ7A50T-1CS325M chip model is a powerful and versatile processor designed for high-performance digital signal processing, embedded processing, and image processing. It is expected to be in high demand in the near future, as the demand for powerful and efficient processors continues to grow. The model is highly integrated and can be used for a wide range of tasks, from digital signal processing to embedded processing and image processing. Additionally, the model is designed to be easily upgradable, allowing users to upgrade their processor as new technologies become available. Furthermore, the model is suitable for use in advanced communication systems, making it ideal for the development of advanced communication systems.
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