XQ7A50T-1CS325M
XQ7A50T-1CS325M
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rohs

AMD Xilinx

XQ7A50T-1CS325M


XQ7A50T-1CS325M
F20-XQ7A50T-1CS325M
Active
FIELD PROGRAMMABLE GATE ARRAY, HKMG, CSBGA-325
CSBGA-325

XQ7A50T-1CS325M ECAD Model


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XQ7A50T-1CS325M Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 150
Number of Outputs 150
Number of Logic Cells 52160
Number of CLBs 4075
Combinatorial Delay of a CLB-Max 1.27 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade MILITARY
Package Shape SQUARE
Technology HKMG
Organization 4075 CLBS
Clock Frequency-Max 1.098 GHz
Power Supplies 1 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Number of Terminals 324
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA324,18X18,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Surface Mount YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 800 µm
Terminal Position BOTTOM
Width 15 mm
Length 15 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
ECCN Code 3A001.A.2.C
Package Description CSBGA-325

XQ7A50T-1CS325M Datasheet Download


XQ7A50T-1CS325M Overview



The XQ7A50T-1CS325M chip model is a powerful and versatile processor designed for high-performance digital signal processing, embedded processing, and image processing. It is a highly integrated, low-power, single-chip solution that is suitable for a wide range of applications, from consumer electronics to industrial automation.


The XQ7A50T-1CS325M chip model is based on a 32-bit RISC architecture, with a maximum operating frequency of up to 1.25GHz. It is equipped with a range of peripherals, including two CAN buses, two UARTs, two SPI buses, two I2C buses, and two Ethernet MACs. Additionally, the model has an integrated FPGA, which allows for the use of HDL (Hardware Description Language) programming.


The XQ7A50T-1CS325M chip model is designed to meet the needs of the market for high-performance, low-power processors. It is expected to be in high demand in the near future, as the demand for powerful and efficient processors continues to grow. This chip model is suitable for a variety of applications, including industrial automation, consumer electronics, and communications systems.


The original design intention of the XQ7A50T-1CS325M chip model was to provide a powerful, yet low-power processor solution for a variety of applications. The model is highly integrated and can be used for a wide range of tasks, from digital signal processing to embedded processing and image processing. The model is also designed to be easily upgradable, allowing users to upgrade their processor as new technologies become available.


The XQ7A50T-1CS325M chip model is also suitable for use in advanced communication systems. It is equipped with two CAN buses, two UARTs, two SPI buses, two I2C buses, and two Ethernet MACs, making it ideal for a variety of communication protocols. Additionally, the integrated FPGA allows for the use of HDL programming, making it suitable for the development of advanced communication systems.


Overall, the XQ7A50T-1CS325M chip model is a powerful and versatile processor designed for high-performance digital signal processing, embedded processing, and image processing. It is expected to be in high demand in the near future, as the demand for powerful and efficient processors continues to grow. The model is highly integrated and can be used for a wide range of tasks, from digital signal processing to embedded processing and image processing. Additionally, the model is designed to be easily upgradable, allowing users to upgrade their processor as new technologies become available. Furthermore, the model is suitable for use in advanced communication systems, making it ideal for the development of advanced communication systems.



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