AMD Xilinx
XQ5VLX110-2EF1153I
XQ5VLX110-2EF1153I ECAD Model
XQ5VLX110-2EF1153I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 800 | |
| Number of Outputs | 800 | |
| Number of Logic Cells | 110592 | |
| Number of CLBs | 8640 | |
| Combinatorial Delay of a CLB-Max | 770 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.265 GHz | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1153 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 1153 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1153,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FCBGA-1153 | |
| Pin Count | 1153 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XQ5VLX110-2EF1153I Datasheet Download
XQ5VLX110-2EF1153I Overview
The XQ5VLX110-2EF1153I chip model is a powerful and versatile solution for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a powerful and versatile language for designing complex digital systems.
The XQ5VLX110-2EF1153I chip model is designed to meet the needs of a wide range of applications, from consumer electronics to industrial automation. It is capable of performing complex tasks and operations with excellent speed and accuracy. It also offers a wide range of features and capabilities, such as power management, memory management, and communication interfaces.
The industry trends of the XQ5VLX110-2EF1153I chip model are constantly evolving, as new technologies and advancements are being developed. The development of new technologies and advancements will help to further improve the performance and capabilities of the chip model. Whether the application environment requires the support of new technologies will depend on the specific technologies needed.
The product description and design requirements of the XQ5VLX110-2EF1153I chip model are detailed in the product documentation. This documentation provides information on the features and capabilities of the chip model, as well as the design considerations and precautions that should be taken when designing with the chip model. Case studies of actual implementations of the chip model can also be found in the product documentation.
In conclusion, the XQ5VLX110-2EF1153I chip model is a powerful and versatile solution for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, and its industry trends are constantly evolving. The product documentation provides detailed information on the features and capabilities of the chip model, as well as design considerations and precautions. Case studies of actual implementations of the chip model can also be found in the product documentation.
5,047 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||