
AMD Xilinx
XQ4VLX25-10SF363M
XQ4VLX25-10SF363M ECAD Model
XQ4VLX25-10SF363M Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 240 | |
Number of Outputs | 240 | |
Number of Logic Cells | 24192 | |
Number of CLBs | 2688 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2688 CLBS | |
Clock Frequency-Max | 1.028 GHz | |
Power Supplies | 1.2,1.2/3.3,2.5 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B363 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 363 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA363,20X20,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 800 µm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 1.99 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FCBGA-363 | |
Pin Count | 363 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.39.00.01 |
XQ4VLX25-10SF363M Datasheet Download
XQ4VLX25-10SF363M Overview
The XQ4VLX25-10SF363M chip model is a powerful and reliable solution for digital signal processing, embedded processing, and image processing. It is designed to use HDL language, which is a high-level language for programming digital logic circuits and systems. This chip model is perfect for the most demanding applications, and its future development will depend on the specific technologies that will be needed.
As technology advances and the world moves into an era of fully intelligent systems, the XQ4VLX25-10SF363M chip model will be able to provide the necessary support for these new technologies. It can be used in a wide variety of networks and intelligent scenarios, from industrial automation to robotics and machine learning. Its high-performance and reliable design make it an ideal solution for these applications.
The chip model XQ4VLX25-10SF363M is a powerful and reliable solution for digital signal processing, embedded processing, and image processing. It is designed to use HDL language, which is a high-level language for programming digital logic circuits and systems. This chip model is perfect for the most demanding applications, and its future development will depend on the specific technologies that will be needed. As technology advances and the world moves into an era of fully intelligent systems, the XQ4VLX25-10SF363M chip model will be able to provide the necessary support for these new technologies.
The chip model XQ4VLX25-10SF363M is well suited for applications in the industrial automation sector, as it can provide highly efficient and reliable processing of digital signals. It can also be used in robotics and machine learning applications, providing a high level of performance and accuracy. Additionally, it can be used in networks to provide secure and reliable data transmission. This chip model can also be used in intelligent scenarios, such as facial recognition, object detection, and autonomous navigation.
The XQ4VLX25-10SF363M chip model is an ideal solution for today's digital signal processing, embedded processing, and image processing applications. Its high-performance design and reliable HDL language make it a great choice for these applications. As technology advances and the world moves into an era of fully intelligent systems, the XQ4VLX25-10SF363M chip model will be able to provide the necessary support for these new technologies. It can be used in a wide variety of networks and intelligent scenarios, from industrial automation to robotics and machine learning.
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