XQ4062XL-3HQ240N
XQ4062XL-3HQ240N
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rohs

AMD Xilinx

XQ4062XL-3HQ240N


XQ4062XL-3HQ240N
F20-XQ4062XL-3HQ240N
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 32 X 32 MM, HEAT SINK, METRIC, DIE-UP, PLASTIC, MO-143GA, QFP-240
32 X 32 MM, HEAT SINK, METRIC, DIE-UP, PLASTIC, MO-143GA, QFP-240

XQ4062XL-3HQ240N ECAD Model


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XQ4062XL-3HQ240N Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Inputs 193
Number of Outputs 193
Number of Logic Cells 5472
Number of Equivalent Gates 40000
Number of CLBs 2304
Combinatorial Delay of a CLB-Max 1.6 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Screening Level MIL-PRF-38535
Temperature Grade MILITARY
Package Shape SQUARE
Technology CMOS
Organization 2304 CLBS, 40000 GATES
Additional Feature TYPICAL GATES = 40000 TO 130000
Clock Frequency-Max 166 MHz
Power Supplies 3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PQFP-G240
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 240
Package Body Material PLASTIC/EPOXY
Package Code HFQFP
Package Equivalence Code HQFP240,1.37SQ,20
Package Shape SQUARE
Package Style FLATPACK, HEAT SINK/SLUG, FINE PITCH
Surface Mount YES
Terminal Finish Tin/Lead (Sn85Pb15)
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 32 mm
Length 32 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code unknown
HTS Code 8542.39.00.01
Part Package Code QFP
Package Description 32 X 32 MM, HEAT SINK, METRIC, DIE-UP, PLASTIC, MO-143GA, QFP-240
Pin Count 240
ECCN Code 3A001.A.2.C

XQ4062XL-3HQ240N Datasheet Download


XQ4062XL-3HQ240N Overview



The chip model XQ4062XL-3HQ240N is a specialized integrated circuit designed for advanced communication systems. It is a high-performance device that provides a wide range of functions, from basic signal processing to higher-level communication protocols. This chip model has been designed with the intention of providing a reliable, cost-effective solution for communication systems.


As the industry trends of the chip model XQ4062XL-3HQ240N are constantly evolving, it is necessary to consider the possibility of future upgrades. This chip model can be upgraded to support new technologies, such as 5G and Wi-Fi 6, to ensure that it remains up-to-date with the latest industry standards. This will ensure that the chip model XQ4062XL-3HQ240N remains a viable option for communication systems in the future.


In addition to communication systems, the chip model XQ4062XL-3HQ240N can also be applied to the development and popularization of future intelligent robots. This chip model is capable of providing the necessary computing power and signal processing capabilities needed to enable robots to interact with their environment. Furthermore, the chip model can be used to develop advanced artificial intelligence algorithms that can be used to power the robots.


To use the chip model XQ4062XL-3HQ240N effectively, certain technical talents are needed. Knowledge of integrated circuit design, signal processing, and artificial intelligence algorithms is essential for understanding how to use the chip model. Furthermore, knowledge of communication systems is also important for understanding how to apply the chip model to communication systems.


In conclusion, the chip model XQ4062XL-3HQ240N is a specialized integrated circuit designed for advanced communication systems. It has the potential to be upgraded to support new technologies, and can also be applied to the development and popularization of future intelligent robots. To use the chip model XQ4062XL-3HQ240N effectively, certain technical talents are needed, such as knowledge of integrated circuit design, signal processing, and artificial intelligence algorithms.



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