
AMD Xilinx
XQ4062XL-3HQ240N
XQ4062XL-3HQ240N ECAD Model
XQ4062XL-3HQ240N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 193 | |
Number of Outputs | 193 | |
Number of Logic Cells | 5472 | |
Number of Equivalent Gates | 40000 | |
Number of CLBs | 2304 | |
Combinatorial Delay of a CLB-Max | 1.6 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Screening Level | MIL-PRF-38535 | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2304 CLBS, 40000 GATES | |
Additional Feature | TYPICAL GATES = 40000 TO 130000 | |
Clock Frequency-Max | 166 MHz | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PQFP-G240 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 240 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HFQFP | |
Package Equivalence Code | HQFP240,1.37SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn85Pb15) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 32 mm | |
Length | 32 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Part Package Code | QFP | |
Package Description | 32 X 32 MM, HEAT SINK, METRIC, DIE-UP, PLASTIC, MO-143GA, QFP-240 | |
Pin Count | 240 | |
ECCN Code | 3A001.A.2.C |
XQ4062XL-3HQ240N Datasheet Download
XQ4062XL-3HQ240N Overview
The chip model XQ4062XL-3HQ240N is a specialized integrated circuit designed for advanced communication systems. It is a high-performance device that provides a wide range of functions, from basic signal processing to higher-level communication protocols. This chip model has been designed with the intention of providing a reliable, cost-effective solution for communication systems.
As the industry trends of the chip model XQ4062XL-3HQ240N are constantly evolving, it is necessary to consider the possibility of future upgrades. This chip model can be upgraded to support new technologies, such as 5G and Wi-Fi 6, to ensure that it remains up-to-date with the latest industry standards. This will ensure that the chip model XQ4062XL-3HQ240N remains a viable option for communication systems in the future.
In addition to communication systems, the chip model XQ4062XL-3HQ240N can also be applied to the development and popularization of future intelligent robots. This chip model is capable of providing the necessary computing power and signal processing capabilities needed to enable robots to interact with their environment. Furthermore, the chip model can be used to develop advanced artificial intelligence algorithms that can be used to power the robots.
To use the chip model XQ4062XL-3HQ240N effectively, certain technical talents are needed. Knowledge of integrated circuit design, signal processing, and artificial intelligence algorithms is essential for understanding how to use the chip model. Furthermore, knowledge of communication systems is also important for understanding how to apply the chip model to communication systems.
In conclusion, the chip model XQ4062XL-3HQ240N is a specialized integrated circuit designed for advanced communication systems. It has the potential to be upgraded to support new technologies, and can also be applied to the development and popularization of future intelligent robots. To use the chip model XQ4062XL-3HQ240N effectively, certain technical talents are needed, such as knowledge of integrated circuit design, signal processing, and artificial intelligence algorithms.
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