XQ4036XL-3BG352N
XQ4036XL-3BG352N
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rohs

AMD Xilinx

XQ4036XL-3BG352N


XQ4036XL-3BG352N
F20-XQ4036XL-3BG352N
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 35 X 35 MM, PLASTIC, MO-151, BGA-352
35 X 35 MM, PLASTIC, MO-151, BGA-352

XQ4036XL-3BG352N ECAD Model


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XQ4036XL-3BG352N Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Inputs 288
Number of Outputs 288
Number of Logic Cells 3078
Number of Equivalent Gates 22000
Number of CLBs 1296
Combinatorial Delay of a CLB-Max 1.6 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Screening Level MIL-PRF-38535
Temperature Grade MILITARY
Package Shape SQUARE
Technology CMOS
Organization 1296 CLBS, 22000 GATES
Additional Feature TYPICAL GATES = 22000 TO 65000
Clock Frequency-Max 166 MHz
Power Supplies 3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B352
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 352
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA352,26X26,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 35 X 35 MM, PLASTIC, MO-151, BGA-352
Pin Count 352
Reach Compliance Code not_compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01

XQ4036XL-3BG352N Datasheet Download


XQ4036XL-3BG352N Overview



The chip model XQ4036XL-3BG352N is a cutting-edge semiconductor device that has been developed to meet the needs of modern communication systems. It is a highly integrated device that offers a variety of features, including a low power consumption, high speed data transfer, and a wide range of interfaces for connecting to various types of devices.


The chip model XQ4036XL-3BG352N is designed to meet the needs of current and future communication systems. It is capable of supporting a wide range of technologies, including advanced wireless communication protocols, high-speed data transfer, and various types of networking technologies. With its advanced features and capabilities, it can be used in a variety of scenarios, including networks, home automation, and industrial automation.


The chip model XQ4036XL-3BG352N is also designed to be future-proof. It is designed to be easily upgradable, allowing it to be used in the most advanced communication systems. It is also designed to be compatible with the latest technologies, such as 5G networks and artificial intelligence. This ensures that the chip model XQ4036XL-3BG352N can be used in the era of fully intelligent systems.


In addition, the chip model XQ4036XL-3BG352N can be used in a variety of intelligent scenarios. It can be used in networks to provide reliable, high-speed data transfer. It can also be used in home automation systems to control various devices, such as lights and appliances. Furthermore, it can be used in industrial automation systems to monitor and control various processes.


In short, the chip model XQ4036XL-3BG352N is a highly advanced semiconductor device that is designed to meet the needs of current and future communication systems. It is capable of supporting a wide range of technologies, including advanced wireless communication protocols, high-speed data transfer, and various types of networking technologies. Furthermore, it is designed to be easily upgradable and compatible with the latest technologies, such as 5G networks and artificial intelligence. Finally, it can be used in a variety of intelligent scenarios, such as networks, home automation, and industrial automation.



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