
AMD Xilinx
XQ4036XL-3BG352N
XQ4036XL-3BG352N ECAD Model
XQ4036XL-3BG352N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 288 | |
Number of Outputs | 288 | |
Number of Logic Cells | 3078 | |
Number of Equivalent Gates | 22000 | |
Number of CLBs | 1296 | |
Combinatorial Delay of a CLB-Max | 1.6 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Screening Level | MIL-PRF-38535 | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1296 CLBS, 22000 GATES | |
Additional Feature | TYPICAL GATES = 22000 TO 65000 | |
Clock Frequency-Max | 166 MHz | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PBGA-B352 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 352 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA352,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 35 X 35 MM, PLASTIC, MO-151, BGA-352 | |
Pin Count | 352 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.39.00.01 |
XQ4036XL-3BG352N Datasheet Download
XQ4036XL-3BG352N Overview
The chip model XQ4036XL-3BG352N is a cutting-edge semiconductor device that has been developed to meet the needs of modern communication systems. It is a highly integrated device that offers a variety of features, including a low power consumption, high speed data transfer, and a wide range of interfaces for connecting to various types of devices.
The chip model XQ4036XL-3BG352N is designed to meet the needs of current and future communication systems. It is capable of supporting a wide range of technologies, including advanced wireless communication protocols, high-speed data transfer, and various types of networking technologies. With its advanced features and capabilities, it can be used in a variety of scenarios, including networks, home automation, and industrial automation.
The chip model XQ4036XL-3BG352N is also designed to be future-proof. It is designed to be easily upgradable, allowing it to be used in the most advanced communication systems. It is also designed to be compatible with the latest technologies, such as 5G networks and artificial intelligence. This ensures that the chip model XQ4036XL-3BG352N can be used in the era of fully intelligent systems.
In addition, the chip model XQ4036XL-3BG352N can be used in a variety of intelligent scenarios. It can be used in networks to provide reliable, high-speed data transfer. It can also be used in home automation systems to control various devices, such as lights and appliances. Furthermore, it can be used in industrial automation systems to monitor and control various processes.
In short, the chip model XQ4036XL-3BG352N is a highly advanced semiconductor device that is designed to meet the needs of current and future communication systems. It is capable of supporting a wide range of technologies, including advanced wireless communication protocols, high-speed data transfer, and various types of networking technologies. Furthermore, it is designed to be easily upgradable and compatible with the latest technologies, such as 5G networks and artificial intelligence. Finally, it can be used in a variety of intelligent scenarios, such as networks, home automation, and industrial automation.
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Pricing (USD)
QTY | Unit Price | Ext Price |
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