AMD Xilinx
XQ4025E-4CB228M
XQ4025E-4CB228M ECAD Model
XQ4025E-4CB228M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 192 | |
| Number of Outputs | 192 | |
| Number of Logic Cells | 2432 | |
| Number of Equivalent Gates | 15000 | |
| Number of CLBs | 1024 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-PRF-38535 | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1024 CLBS, 15000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES=45000 | |
| Clock Frequency-Max | 111 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-CQFP-F228 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 228 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | GQFF | |
| Package Equivalence Code | TPAK228,2.5SQ,25 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, GUARD RING | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | FLAT | |
| Terminal Pitch | 635 µm | |
| Terminal Position | QUAD | |
| Width | 39.37 mm | |
| Length | 39.37 mm | |
| Seated Height-Max | 3.302 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TOP BRAZED, CERAMIC, QFP-228 | |
| Pin Count | 228 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQ4025E-4CB228M Datasheet Download
XQ4025E-4CB228M Overview
The chip model XQ4025E-4CB228M is a highly advanced semiconductor component that is designed to meet the demands of modern communication systems. It is designed for a wide range of applications, including the most advanced communication systems. It is designed to be highly efficient, with a low power consumption, and to provide a reliable connection between different elements of a communication system.
The design intention of the chip model XQ4025E-4CB228M is to provide a highly reliable connection between different components of a communication system. It is designed with the latest technology and is capable of handling a wide range of data rates. It is also designed to be highly efficient, with a low power consumption. This allows it to be used in a variety of applications, including the most advanced communication systems.
The chip model XQ4025E-4CB228M is also designed with the possibility of future upgrades in mind. It is designed to be able to handle a wide range of data rates and to be able to be upgraded in the future, if needed. This allows it to be used in the most advanced communication systems and to be able to handle the demands of the future.
The chip model XQ4025E-4CB228M can also be used in a variety of intelligent scenarios. It is designed to be able to handle a wide range of data rates and to be able to be used in the era of fully intelligent systems. This allows it to be used in a variety of scenarios, such as in the development of autonomous vehicles, in the development of smart homes, and in the development of smart cities.
The product description and specific design requirements of the chip model XQ4025E-4CB228M are outlined in detail in the product manual. This includes information on the design parameters, the design goals, the design process, and the design verification process. It also includes information on the actual case studies and the precautions that need to be taken when using the chip in a communication system.
The chip model XQ4025E-4CB228M is a highly advanced semiconductor component that is designed to meet the demands of modern communication systems. It is designed for a wide range of applications, including the most advanced communication systems. It is designed to be highly efficient, with a low power consumption, and to provide a reliable connection between different elements of a communication system. It is also designed with the possibility of future upgrades in mind, and is capable of being used in a variety of intelligent scenarios. The product description and specific design requirements are outlined in detail in the product manual, along with actual case studies and precautions that need to be taken when using the chip in a communication system.
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2,693 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,077.9280 | $3,077.9280 |
| 10+ | $3,044.8320 | $30,448.3200 |
| 100+ | $2,879.3520 | $287,935.2000 |
| 1000+ | $2,713.8720 | $1,356,936.0000 |
| 10000+ | $2,482.2000 | $2,482,200.0000 |
| The price is for reference only, please refer to the actual quotation! | ||