AMD Xilinx
XQ4013XL-3BG256N
XQ4013XL-3BG256N ECAD Model
XQ4013XL-3BG256N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 192 | |
| Number of Outputs | 192 | |
| Number of Logic Cells | 1368 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-PRF-38535 | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | TYPICAL GATES = 10000 TO 30000 | |
| Clock Frequency-Max | 166 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,20X20,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, PLASTIC, MO-151CAL, BGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQ4013XL-3BG256N Datasheet Download
XQ4013XL-3BG256N Overview
The XQ4013XL-3BG256N chip model is a highly advanced, powerful system on chip (SoC) that provides a versatile range of capabilities for a variety of applications. It is designed for high-performance digital signal processing, embedded processing, image processing, and other digital signal processing tasks. It is also capable of supporting the use of HDL (Hardware Description Language) for programming.
The XQ4013XL-3BG256N chip model offers a number of advantages over traditional digital signal processing solutions. It is more energy efficient, faster, and more reliable than other solutions. It also offers a wide range of features, including a large number of digital signal processing cores and a high degree of scalability, making it suitable for a variety of applications. Additionally, the chip model is designed to be highly configurable, allowing users to customize it to their specific needs.
The XQ4013XL-3BG256N chip model is expected to be in high demand in the future, as the number of applications and technologies that require digital signal processing continues to grow. This chip model is well-suited to a wide range of applications, including automotive, industrial, and medical applications. Additionally, the chip model is designed to be highly compatible with a variety of communication systems, making it suitable for a variety of advanced communication systems.
The original design intention of the XQ4013XL-3BG256N chip model was to provide a versatile, powerful solution for digital signal processing applications. It is designed to be highly configurable, allowing users to customize it to their specific needs. Additionally, it is designed to be highly compatible with a variety of communication systems, making it suitable for a variety of advanced communication systems. The chip model is also designed to be highly scalable, allowing users to upgrade it as their needs change.
Overall, the XQ4013XL-3BG256N chip model is an advanced, powerful system on chip (SoC) that provides a versatile range of capabilities for a variety of applications. It is designed for high-performance digital signal processing, embedded processing, image processing, and other digital signal processing tasks. It is also capable of supporting the use of HDL (Hardware Description Language) for programming. It is expected to be in high demand in the future, as the number of applications and technologies that require digital signal processing continues to grow. Additionally, the chip model is designed to be highly configurable, allowing users to customize it to their specific needs. It is also designed to be highly compatible with a variety of communication systems, making it suitable for a variety of advanced communication systems.
2,510 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||