AMD Xilinx
XQ2VP70-6EF1704I
XQ2VP70-6EF1704I ECAD Model
XQ2VP70-6EF1704I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of CLBs | 8272 | |
| Combinatorial Delay of a CLB-Max | 320 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8272 CLBS | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1704 | |
| JESD-609 Code | e0 | |
| Number of Terminals | 1704 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.45 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.5 X 42.5 MM, 1 MM PITCH, MS-034AAV-1, FBGA-1704 | |
| Pin Count | 1704 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XQ2VP70-6EF1704I Datasheet Download
XQ2VP70-6EF1704I Overview
The XQ2VP70-6EF1704I chip model is a powerful and versatile processor designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using the Hardware Description Language (HDL) to provide the flexibility and robustness needed for these applications. The model is capable of providing an impressive amount of computing power, and its capabilities are expected to continue to increase in the future.
The XQ2VP70-6EF1704I chip model was designed with the intention of providing a high-performance, low-power processor that can be used in a variety of applications. It is capable of providing a wide range of capabilities, including the ability to process data quickly, accurately, and reliably. The model is also designed to be easily upgradeable, allowing for the addition of new features and capabilities.
The XQ2VP70-6EF1704I chip model is expected to become increasingly popular in the future, as it is capable of providing a high level of performance and reliability. Its capabilities make it ideal for use in a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. Additionally, the model is expected to be used in advanced communication systems, as its features and capabilities make it well-suited to this type of application.
The XQ2VP70-6EF1704I chip model is a powerful and versatile processor that has been designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. Its design allows for flexibility and robustness, and its capabilities are expected to continue to increase in the future. Additionally, the model is expected to become increasingly popular in a variety of industries, as it is capable of providing a high level of performance and reliability. Finally, the model is expected to be used in advanced communication systems, as its features and capabilities make it well-suited to this type of application.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||