
AMD Xilinx
XQ2VP40-5FG676N
XQ2VP40-5FG676N ECAD Model
XQ2VP40-5FG676N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 416 | |
Number of Outputs | 416 | |
Number of Logic Cells | 43632 | |
Number of CLBs | 4848 | |
Combinatorial Delay of a CLB-Max | 360 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4848 CLBS | |
Clock Frequency-Max | 1.05 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | HBGA, BGA676,26X26,40 | |
Pin Count | 676 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.39.00.01 |
XQ2VP40-5FG676N Datasheet Download
XQ2VP40-5FG676N Overview
The chip model XQ2VP40-5FG676N is a cutting-edge development in the semiconductor industry. It is a high-performance, low-power, low-cost product that has been designed to meet the needs of the modern world. This chip model is a great example of the continuous advancement of technology and its application in the field of computing.
The XQ2VP40-5FG676N chip model is a product of advanced technology, with features such as high-speed processing, low-power consumption, and low-cost production. It is also designed to be compatible with various operating systems and communication protocols. This makes it ideal for use in a variety of applications, including industrial automation, robotics, and communication systems.
The chip model XQ2VP40-5FG676N has been designed to be highly efficient, with a low power consumption and low cost production. This makes it an attractive option for many industries, including automotive, aerospace, and telecommunications. As the demand for such chips continues to grow, the XQ2VP40-5FG676N is expected to become even more popular in the future.
The original design intention of the chip model XQ2VP40-5FG676N was to provide a cost-effective solution for high-performance computing. It was designed with the capability to support advanced communication systems, such as those used in 5G networks. This means that the chip model XQ2VP40-5FG676N can be used for a variety of applications, including the development of new technologies and the support of existing ones.
In the future, the XQ2VP40-5FG676N chip model is expected to be upgraded to meet the needs of the ever-evolving technology landscape. This could include the development of new features and capabilities, as well as the support of advanced communication systems. As the demand for such chips continues to grow, the XQ2VP40-5FG676N is expected to become an even more attractive option for many industries.
In conclusion, the chip model XQ2VP40-5FG676N is a cutting-edge development in the semiconductor industry. It is a high-performance, low-power, low-cost product that has been designed to meet the needs of the modern world. It is expected to become even more popular in the future, as the demand for such chips increases and the need for advanced communication systems grows. The chip model XQ2VP40-5FG676N is also expected to be upgraded in the future, with the possibility of new features and capabilities being added. This makes it an attractive option for many industries, including automotive, aerospace, and telecommunications.
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Pricing (USD)
QTY | Unit Price | Ext Price |
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