XQ2VP40-5FG676N
XQ2VP40-5FG676N
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rohs

AMD Xilinx

XQ2VP40-5FG676N


XQ2VP40-5FG676N
F20-XQ2VP40-5FG676N
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, HBGA, BGA676,26X26,40
HBGA, BGA676,26X26,40

XQ2VP40-5FG676N ECAD Model


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XQ2VP40-5FG676N Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 416
Number of Outputs 416
Number of Logic Cells 43632
Number of CLBs 4848
Combinatorial Delay of a CLB-Max 360 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade MILITARY
Package Shape SQUARE
Technology CMOS
Organization 4848 CLBS
Clock Frequency-Max 1.05 GHz
Power Supplies 1.5,1.5/3.3,2/2.5,2.5 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description HBGA, BGA676,26X26,40
Pin Count 676
Reach Compliance Code not_compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01

XQ2VP40-5FG676N Datasheet Download


XQ2VP40-5FG676N Overview



The chip model XQ2VP40-5FG676N is a cutting-edge development in the semiconductor industry. It is a high-performance, low-power, low-cost product that has been designed to meet the needs of the modern world. This chip model is a great example of the continuous advancement of technology and its application in the field of computing.


The XQ2VP40-5FG676N chip model is a product of advanced technology, with features such as high-speed processing, low-power consumption, and low-cost production. It is also designed to be compatible with various operating systems and communication protocols. This makes it ideal for use in a variety of applications, including industrial automation, robotics, and communication systems.


The chip model XQ2VP40-5FG676N has been designed to be highly efficient, with a low power consumption and low cost production. This makes it an attractive option for many industries, including automotive, aerospace, and telecommunications. As the demand for such chips continues to grow, the XQ2VP40-5FG676N is expected to become even more popular in the future.


The original design intention of the chip model XQ2VP40-5FG676N was to provide a cost-effective solution for high-performance computing. It was designed with the capability to support advanced communication systems, such as those used in 5G networks. This means that the chip model XQ2VP40-5FG676N can be used for a variety of applications, including the development of new technologies and the support of existing ones.


In the future, the XQ2VP40-5FG676N chip model is expected to be upgraded to meet the needs of the ever-evolving technology landscape. This could include the development of new features and capabilities, as well as the support of advanced communication systems. As the demand for such chips continues to grow, the XQ2VP40-5FG676N is expected to become an even more attractive option for many industries.


In conclusion, the chip model XQ2VP40-5FG676N is a cutting-edge development in the semiconductor industry. It is a high-performance, low-power, low-cost product that has been designed to meet the needs of the modern world. It is expected to become even more popular in the future, as the demand for such chips increases and the need for advanced communication systems grows. The chip model XQ2VP40-5FG676N is also expected to be upgraded in the future, with the possibility of new features and capabilities being added. This makes it an attractive option for many industries, including automotive, aerospace, and telecommunications.



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