AMD Xilinx
XQ2V3000-4CG717M
XQ2V3000-4CG717M ECAD Model
XQ2V3000-4CG717M Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 516 | |
| Number of Outputs | 516 | |
| Number of Logic Cells | 32256 | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 3584 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3584 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-CBGA-X717 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 717 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | CGA | |
| Package Equivalence Code | CGA717,27X27,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | UNSPECIFIED | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.3 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | CGA | |
| Package Description | CERAMIC, CGA-717 | |
| Pin Count | 717 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQ2V3000-4CG717M Datasheet Download
XQ2V3000-4CG717M Overview
The XQ2V3000-4CG717M is a chip model that is suitable for a wide range of applications, from high-performance digital signal processing to embedded processing and image processing. It is an ideal choice for developers who need to use a HDL language for their projects.
The XQ2V3000-4CG717M chip model has several advantages over other models. It is powerful enough to handle complex tasks, such as image processing and embedded systems. It also has a low power consumption, making it ideal for applications that require long battery life. Furthermore, its relatively small size makes it easy to integrate into a variety of systems.
The demand for the XQ2V3000-4CG717M chip model is expected to increase in the future due to its versatility and cost-effectiveness. As more and more industries begin to adopt new technologies, the need for reliable and efficient chip models will continue to grow. The XQ2V3000-4CG717M is well-suited to meet these needs and is expected to remain a popular choice for developers in the years to come.
The XQ2V3000-4CG717M chip model can be used in the development and popularization of future intelligent robots. It is powerful enough to handle the complex tasks that robots need to perform, such as navigation and object recognition. However, it is important to note that the use of the XQ2V3000-4CG717M chip model requires technical expertise. Developers must be familiar with HDL language and have a good understanding of the chip model’s capabilities in order to use it effectively.
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