XQ2V1000-4BG575N
XQ2V1000-4BG575N
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rohs

AMD Xilinx

XQ2V1000-4BG575N


XQ2V1000-4BG575N
F20-XQ2V1000-4BG575N
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 1.27 MM PITCH, MS-034BAN-1, BGA-575
1.27 MM PITCH, MS-034BAN-1, BGA-575

XQ2V1000-4BG575N ECAD Model


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XQ2V1000-4BG575N Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 328
Number of Outputs 328
Number of Logic Cells 11520
Number of Equivalent Gates 1000000
Number of CLBs 1280
Combinatorial Delay of a CLB-Max 440 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade MILITARY
Package Shape SQUARE
Technology CMOS
Organization 1280 CLBS, 1000000 GATES
Clock Frequency-Max 650 MHz
Power Supplies 1.5,1.5/3.3,3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B575
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) 225
Number of Terminals 575
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA575,24X24,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 31 mm
Length 31 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 1.27 MM PITCH, MS-034BAN-1, BGA-575
Pin Count 575
Reach Compliance Code not_compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01

XQ2V1000-4BG575N Datasheet Download


XQ2V1000-4BG575N Overview



The XQ2V1000-4BG575N chip model is a high-performance digital signal processor (DSP) designed for embedded processing, image processing, and other applications. It is based on the Xilinx Virtex-II Pro FPGA architecture and is programmed in HDL (Hardware Description Language) language. This chip model is suitable for high-performance embedded systems, digital signal processing, image processing, and other applications.


The XQ2V1000-4BG575N chip model has several advantages that make it desirable for use in embedded systems. It has high-speed operation, low power consumption, and a small form factor. It is also highly configurable and can be tailored to the specific needs of a given application. Additionally, the chip model supports a wide range of peripherals, making it a versatile solution for a variety of applications.


The XQ2V1000-4BG575N chip model is expected to remain popular in the future. As embedded systems become more complex and require more powerful processors, the XQ2V1000-4BG575N chip model is well-suited for these applications. Additionally, as the demand for digital signal processing, image processing, and other applications increases, the XQ2V1000-4BG575N chip model is expected to remain a popular choice.


The future development of the XQ2V1000-4BG575N chip model and related industries will depend on the specific technologies needed. New technologies such as artificial intelligence, machine learning, and 5G networks may be required to meet the demands of future applications. Additionally, as the demand for embedded systems increases, new technologies such as the Internet of Things (IoT) and edge computing will become more important.


In conclusion, the XQ2V1000-4BG575N chip model is a high-performance DSP that is suitable for embedded systems, digital signal processing, image processing, and other applications. It has several advantages including high-speed operation, low power consumption, and a small form factor. The chip model is expected to remain popular in the future as the demand for embedded systems and digital signal processing increases. The future development of the chip model and related industries will depend on the specific technologies needed.



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