
AMD Xilinx
XQ2V1000-4BG575N
XQ2V1000-4BG575N ECAD Model
XQ2V1000-4BG575N Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 328 | |
Number of Outputs | 328 | |
Number of Logic Cells | 11520 | |
Number of Equivalent Gates | 1000000 | |
Number of CLBs | 1280 | |
Combinatorial Delay of a CLB-Max | 440 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1280 CLBS, 1000000 GATES | |
Clock Frequency-Max | 650 MHz | |
Power Supplies | 1.5,1.5/3.3,3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B575 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Number of Terminals | 575 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA575,24X24,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 31 mm | |
Length | 31 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 1.27 MM PITCH, MS-034BAN-1, BGA-575 | |
Pin Count | 575 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.39.00.01 |
XQ2V1000-4BG575N Datasheet Download
XQ2V1000-4BG575N Overview
The XQ2V1000-4BG575N chip model is a high-performance digital signal processor (DSP) designed for embedded processing, image processing, and other applications. It is based on the Xilinx Virtex-II Pro FPGA architecture and is programmed in HDL (Hardware Description Language) language. This chip model is suitable for high-performance embedded systems, digital signal processing, image processing, and other applications.
The XQ2V1000-4BG575N chip model has several advantages that make it desirable for use in embedded systems. It has high-speed operation, low power consumption, and a small form factor. It is also highly configurable and can be tailored to the specific needs of a given application. Additionally, the chip model supports a wide range of peripherals, making it a versatile solution for a variety of applications.
The XQ2V1000-4BG575N chip model is expected to remain popular in the future. As embedded systems become more complex and require more powerful processors, the XQ2V1000-4BG575N chip model is well-suited for these applications. Additionally, as the demand for digital signal processing, image processing, and other applications increases, the XQ2V1000-4BG575N chip model is expected to remain a popular choice.
The future development of the XQ2V1000-4BG575N chip model and related industries will depend on the specific technologies needed. New technologies such as artificial intelligence, machine learning, and 5G networks may be required to meet the demands of future applications. Additionally, as the demand for embedded systems increases, new technologies such as the Internet of Things (IoT) and edge computing will become more important.
In conclusion, the XQ2V1000-4BG575N chip model is a high-performance DSP that is suitable for embedded systems, digital signal processing, image processing, and other applications. It has several advantages including high-speed operation, low power consumption, and a small form factor. The chip model is expected to remain popular in the future as the demand for embedded systems and digital signal processing increases. The future development of the chip model and related industries will depend on the specific technologies needed.
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