AMD Xilinx
XQ17V16CC44M
XQ17V16CC44M ECAD Model
XQ17V16CC44M Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 16.7772 Mbit | |
| Memory Width | 8 | |
| Organization | 2MX8 | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Power Supplies | 3.3 V | |
| Access Time-Max | 20 ns | |
| Clock Frequency-Max (fCLK) | 33 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 2000000 | |
| Number of Words | 2.0972 M | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | PARALLEL/SERIAL | |
| Standby Current-Max | 1 mA | |
| Supply Current-Max | 100 µA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| JESD-30 Code | S-CQCC-J44 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 44 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC44,.7SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Seated Height-Max | 4.826 mm | |
| Length | 16.51 mm | |
| Width | 16.51 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | CERAMIC, LCC-44 | |
| Pin Count | 44 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 |
XQ17V16CC44M Datasheet Download
XQ17V16CC44M Overview
The chip model XQ17V16CC44M is a highly advanced and powerful integrated circuit (IC) designed to meet the needs of a variety of industries. This model is an ideal choice for those who are looking for reliable and efficient solutions for their projects. It is designed to offer high performance, low power consumption, and small form factor.
The XQ17V16CC44M has several advantages that make it a great choice for many applications. First, it has a high-speed processing capability, allowing for fast and efficient operations. Additionally, it is designed with a low power consumption that helps reduce energy costs. Furthermore, its small form factor makes it easy to integrate into any system without sacrificing performance.
The XQ17V16CC44M is expected to be in high demand in the future due to its versatile applications. It is ideal for use in industrial automation, medical, automotive, and consumer electronics. It can be used in networks to provide reliable and efficient communication and data transfer. Additionally, it can be used in intelligent scenarios such as machine learning, natural language processing, and image recognition.
The XQ17V16CC44M is designed with several specific requirements in mind. It has a maximum clock frequency of up to 100 MHz, a supply voltage of 1.8V to 3.3V, and a maximum operating temperature of 85°C. It also has a 32-bit bus width, 16KB of SRAM, and 8KB of ROM. Additionally, it is designed with a power-saving mode and a built-in watchdog timer to help ensure reliable operations.
To illustrate the capabilities of the XQ17V16CC44M, consider the following case study. A company was able to use the chip model to develop a system that was able to accurately detect and classify objects in a video feed. This system was able to achieve a high accuracy rate with minimal power consumption.
When using the XQ17V16CC44M, it is important to take certain precautions. It is important to ensure that the device is properly powered and that the voltage is within the specified range. Additionally, it is important to ensure that the system is properly cooled to prevent overheating.
In conclusion, the XQ17V16CC44M is a powerful and versatile IC that can be used in a variety of applications. It offers high performance, low power consumption, and a small form factor. It is expected to be in high demand in the future due to its versatile applications and its ability to be used in intelligent scenarios. Additionally, it is designed with specific requirements in mind and can be used in actual case studies. However, it is important to take certain precautions when using this chip model to ensure reliable operations.
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