AMD Xilinx
XQ1701LSO20N
XQ1701LSO20N ECAD Model
XQ1701LSO20N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 1.0486 Mbit | |
| Memory Width | 1 | |
| Organization | 1MX1 | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Power Supplies | 3.3 V | |
| Clock Frequency-Max (fCLK) | 15 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 1000000 | |
| Number of Words | 1.0486 M | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | SERIAL | |
| Standby Current-Max | 50 µA | |
| Supply Current-Max | 5 µA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| JESD-30 Code | R-PDSO-G20 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Screening Level | MIL-PRF-38535 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 20 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP20,.4 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Seated Height-Max | 2.65 mm | |
| Length | 12.8 mm | |
| Width | 7.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | SOIC | |
| Package Description | PLASTIC, SOIC-20 | |
| Pin Count | 20 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQ1701LSO20N Datasheet Download
XQ1701LSO20N Overview
The chip model XQ1701LSO20N is a highly advanced and powerful chip model that has been developed in recent years. It is widely used in various industries and applications due to its impressive performance, efficiency, and cost-effectiveness. As the chip model advances and the industry trends continue to evolve, the demand for XQ1701LSO20N will only increase in the future.
The XQ1701LSO20N chip model has many advantages that make it an attractive option for a variety of applications. It is designed with a low-power consumption architecture, which makes it a great option for low-power applications. Additionally, the chip model has a high-speed processing capability, allowing it to handle complex tasks quickly and efficiently. Furthermore, the chip model features a high-level of integration, making it a great choice for embedded systems.
In terms of future applications and industry trends, the XQ1701LSO20N chip model is expected to be used in a wide range of networks, including wireless, cellular, and satellite networks. It is also expected to be used in a variety of intelligent scenarios, such as robotics, automation, and smart cities. Additionally, the chip model is expected to be used in the era of fully intelligent systems, such as AI-driven systems.
The XQ1701LSO20N chip model is a highly advanced and powerful chip model that is expected to be used in a variety of applications and industries in the future. It is designed with a low-power consumption architecture, high-speed processing capability, and high-level of integration, making it a great choice for embedded systems, networks, and intelligent scenarios. As the industry trends continue to evolve, the demand for XQ1701LSO20N is expected to increase in the future, and it is likely to be used in the era of fully intelligent systems.
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