AMD Xilinx
XCZU5EG-L1SFVC784I
XCZU5EG-L1SFVC784I ECAD Model
XCZU5EG-L1SFVC784I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B784 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 784 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA784,28X28,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.32 mm | |
| Width | 23 mm | |
| Length | 23 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-784 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU5EG-L1SFVC784I Datasheet Download
XCZU5EG-L1SFVC784I Overview
The chip model XCZU5EG-L1SFVC784I is a powerful, high-performance digital signal processor (DSP) designed for embedded processing, image processing and other applications. It is capable of processing complex data in real time, making it suitable for a variety of applications. The chip is programmed using the HDL language, which is a hardware-level language that allows for high speed and accuracy.
The chip model XCZU5EG-L1SFVC784I is designed to meet the needs of today’s digital signal processing, embedded processing and image processing applications. It is designed to be flexible and able to handle the growing complexity of these applications. The chip is designed to be upgradeable, allowing for future upgrades and applications that require more power and speed.
The chip model XCZU5EG-L1SFVC784I is also designed to be able to handle the latest technologies, such as 5G and other advanced communication systems. It is designed to be able to process data quickly and accurately, allowing for faster data transmission and more efficient communication. The chip is also designed to be able to handle the increasing complexity of these systems, allowing for more efficient and reliable communication.
The original design intention of the chip model XCZU5EG-L1SFVC784I was to provide a powerful, high-performance DSP for the embedded processing, image processing and other applications that require the use of the HDL language. The chip is designed to be flexible and upgradeable, allowing for future upgrades and applications that require more power and speed. It is also designed to be able to handle the latest technologies and advanced communication systems, allowing for faster data transmission and more efficient communication. The chip is a powerful tool for the future of digital signal processing, embedded processing and image processing applications.
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2,209 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,411.1448 | $1,411.1448 |
| 10+ | $1,395.9712 | $13,959.7120 |
| 100+ | $1,320.1032 | $132,010.3200 |
| 1000+ | $1,244.2352 | $622,117.6000 |
| 10000+ | $1,138.0200 | $1,138,020.0000 |
| The price is for reference only, please refer to the actual quotation! | ||