XCZU49DR-2FSVF1760I
XCZU49DR-2FSVF1760I
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rohs

AMD Xilinx

XCZU49DR-2FSVF1760I


XCZU49DR-2FSVF1760I
F20-XCZU49DR-2FSVF1760I
Active
CMOS, FLIPCHIP-1760
FLIPCHIP-1760

XCZU49DR-2FSVF1760I ECAD Model


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XCZU49DR-2FSVF1760I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1760
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FLIPCHIP-1760
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Date Of Intro 2019-02-20

XCZU49DR-2FSVF1760I Datasheet Download


XCZU49DR-2FSVF1760I Overview



The Xilinx Zynq UltraScale+ MPSoC ZU49DR-2FSVF1760I chip model is a powerful tool for meeting the demands of next-generation applications. It is a highly integrated device that combines a 64-bit quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 processor, and a Mali-400 MP2 GPU. This chip model is designed to provide a comprehensive, cost-effective, and scalable solution for a wide range of applications.


In terms of industry trends, the Xilinx Zynq UltraScale+ MPSoC ZU49DR-2FSVF1760I chip model is well-suited for applications that require the highest performance, such as 5G networks, artificial intelligence (AI) and machine learning (ML), Internet of Things (IoT), and automotive. This chip model is also capable of supporting new technologies, such as high-speed memory, high-bandwidth interconnects, and secure hardware acceleration.


The Xilinx Zynq UltraScale+ MPSoC ZU49DR-2FSVF1760I chip model is capable of being used in a variety of intelligent scenarios, such as the development of smart homes, connected cars, and autonomous systems. This chip model is also suitable for applications that require high-speed networking, such as 5G networks and Wi-Fi 6. Additionally, this chip model can be used in fully intelligent systems, such as AI-enabled robots and drones.


In terms of product description, the Xilinx Zynq UltraScale+ MPSoC ZU49DR-2FSVF1760I chip model is designed to provide a comprehensive, cost-effective, and scalable solution for a wide range of applications. This chip model is equipped with a 64-bit quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 processor, and a Mali-400 MP2 GPU, allowing for high-performance computing and graphics capabilities. Additionally, this chip model features a variety of I/O options, such as USB 3.0, PCIe, and Ethernet, to provide a wide range of connectivity options.


When designing applications using the Xilinx Zynq UltraScale+ MPSoC ZU49DR-2FSVF1760I chip model, there are a few key points to keep in mind. Firstly, the chip model should be designed to take advantage of the high-performance capabilities of the processor and GPU. Secondly, the chip model should be designed to be power efficient to ensure that the system meets its power requirements. Finally, the chip model should be designed to be secure to protect the system from malicious attacks.


In conclusion, the Xilinx Zynq UltraScale+ MPSoC ZU49DR-2FSVF1760I chip model is a powerful tool for meeting the demands of next-generation applications. It is capable of being used in a variety of intelligent scenarios, such as the development of smart homes, connected cars, and autonomous systems. Additionally, this chip model is designed to provide a comprehensive, cost-effective, and scalable solution for a wide range of applications. When designing applications using this chip model, it is important to take into account the high-performance capabilities of the processor and GPU, the power efficiency of the system, and the security of the system.



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