AMD Xilinx
XCZU49DR-1FSVF1760E
XCZU49DR-1FSVF1760E ECAD Model
XCZU49DR-1FSVF1760E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FLIPCHIP-1760 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2019-02-20 |
XCZU49DR-1FSVF1760E Datasheet Download
XCZU49DR-1FSVF1760E Overview
The XCZU49DR-1FSVF1760E chip model is an advanced model that offers a wide range of advantages for different industries. It is a high-performance model that provides a low-power solution for a variety of applications. The model is designed to be flexible, allowing for future upgrades and modifications to meet the needs of different industries.
The XCZU49DR-1FSVF1760E chip model has been designed with the intention of providing a high-performance solution for a variety of applications. It is capable of providing a low-power solution for different industries, allowing for future upgrades and modifications. The model is designed to be flexible, allowing for future upgrades and modifications to meet the needs of different industries.
The XCZU49DR-1FSVF1760E chip model has the potential to be used in a wide range of applications in the future. It is expected to be a popular choice for a variety of industries, including the communications industry. The model is capable of providing a low-power solution for different industries, allowing for future upgrades and modifications. It can also be used in advanced communication systems, making it a viable option for a variety of applications.
The XCZU49DR-1FSVF1760E chip model can also be used in networks and intelligent scenarios in the future. It has the potential to be used in the era of fully intelligent systems, allowing for the development of advanced applications. The model is capable of providing a low-power solution for different industries, allowing for future upgrades and modifications. It can also be used in advanced communication systems, making it a viable option for a variety of applications.
In conclusion, the XCZU49DR-1FSVF1760E chip model is an advanced model that offers a wide range of advantages for different industries. It is designed to be flexible, allowing for future upgrades and modifications to meet the needs of different industries. The model is expected to be a popular choice for a variety of industries, including the communications industry. It can also be used in networks and intelligent scenarios in the future, making it a viable option for a variety of applications. The model is capable of providing a low-power solution for different industries, allowing for future upgrades and modifications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||