
AMD Xilinx
XCZU49DR-1FFVF1760I
XCZU49DR-1FFVF1760I ECAD Model
XCZU49DR-1FFVF1760I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B1760 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | FLIPCHIP-1760 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Date Of Intro | 2019-02-20 |
XCZU49DR-1FFVF1760I Datasheet Download
XCZU49DR-1FFVF1760I Overview
The Xilinx XCZU49DR-1FFVF1760I is a state-of-the-art chip model that is designed to offer high-performance computing and communication capabilities. It is a powerful and reliable solution for a variety of applications, including embedded systems, networking, and industrial automation. This chip model is based on the latest Xilinx UltraScale+ architecture, which offers improved performance, scalability, and power efficiency.
The XCZU49DR-1FFVF1760I chip model offers several advantages over other chip models. It features a high-performance, low-power 16nm FinFET+ process technology, which provides greater flexibility and scalability than traditional 28nm or 40nm processes. Additionally, the chip model has a compact form factor and a wide range of features, including a high-speed DDR4 memory interface, Gigabit Ethernet, USB 3.0, and PCIe Gen3.
The XCZU49DR-1FFVF1760I chip model is expected to experience significant demand in the coming years, especially in the fields of embedded systems and industrial automation. This is due to its advanced features, such as its high-speed DDR4 memory interface, Gigabit Ethernet, USB 3.0, and PCIe Gen3, which provide greater performance and scalability than other chip models. Additionally, its compact form factor and low power consumption make it an attractive option for many applications.
The original design intention of the XCZU49DR-1FFVF1760I chip model was to provide high-performance computing and communication capabilities in a compact form factor. The chip model is designed to be flexible and scalable, with features such as a high-speed DDR4 memory interface, Gigabit Ethernet, USB 3.0, and PCIe Gen3. Additionally, it is designed to be easily upgradable, allowing for future upgrades and modifications.
The XCZU49DR-1FFVF1760I chip model can be used in a variety of applications, including embedded systems, networking, and industrial automation. It is capable of supporting advanced communication systems, such as 5G, Wi-Fi 6, and Ethernet. Additionally, it is capable of supporting a wide range of protocols and standards, such as Ethernet, USB, and PCIe.
When using the XCZU49DR-1FFVF1760I chip model, it is important to consider the specific design requirements of the application. For example, the chip model should be able to support the specific protocol and standards required by the application. Additionally, the chip model should be able to support the specific data rates and throughputs required by the application. Finally, the chip model should be able to support the specific power requirements of the application.
The Xilinx XCZU49DR-1FFVF1760I chip model has been used in a variety of applications, including embedded systems, networking, and industrial automation. In these applications, it has proven to be a reliable and powerful solution. Additionally, it has been used in a wide range of case studies, such as the design of a Wi-Fi 6 access point, the development of a 5G base station, and the development of a high-performance data center.
In conclusion, the Xilinx XCZU49DR-1FFVF1760I chip model is a powerful and reliable solution for a variety of applications. It offers a high-performance, low-power 16nm FinFET+ process technology, a compact form factor, and a wide range of features. It is expected to experience significant demand in the coming years, especially in the fields of embedded systems and industrial automation. Additionally, it is capable of supporting advanced communication systems and a wide range of protocols and standards. When using the XCZU49DR-1FFVF1760I chip model, it is important to consider the specific design requirements of the application.
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