XCZU49DR-1FFVF1760I
XCZU49DR-1FFVF1760I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU49DR-1FFVF1760I


XCZU49DR-1FFVF1760I
F20-XCZU49DR-1FFVF1760I
Active
CMOS, FLIPCHIP-1760
FLIPCHIP-1760

XCZU49DR-1FFVF1760I ECAD Model


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XCZU49DR-1FFVF1760I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1760
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FLIPCHIP-1760
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Date Of Intro 2019-02-20

XCZU49DR-1FFVF1760I Datasheet Download


XCZU49DR-1FFVF1760I Overview



The Xilinx XCZU49DR-1FFVF1760I is a state-of-the-art chip model that is designed to offer high-performance computing and communication capabilities. It is a powerful and reliable solution for a variety of applications, including embedded systems, networking, and industrial automation. This chip model is based on the latest Xilinx UltraScale+ architecture, which offers improved performance, scalability, and power efficiency.


The XCZU49DR-1FFVF1760I chip model offers several advantages over other chip models. It features a high-performance, low-power 16nm FinFET+ process technology, which provides greater flexibility and scalability than traditional 28nm or 40nm processes. Additionally, the chip model has a compact form factor and a wide range of features, including a high-speed DDR4 memory interface, Gigabit Ethernet, USB 3.0, and PCIe Gen3.


The XCZU49DR-1FFVF1760I chip model is expected to experience significant demand in the coming years, especially in the fields of embedded systems and industrial automation. This is due to its advanced features, such as its high-speed DDR4 memory interface, Gigabit Ethernet, USB 3.0, and PCIe Gen3, which provide greater performance and scalability than other chip models. Additionally, its compact form factor and low power consumption make it an attractive option for many applications.


The original design intention of the XCZU49DR-1FFVF1760I chip model was to provide high-performance computing and communication capabilities in a compact form factor. The chip model is designed to be flexible and scalable, with features such as a high-speed DDR4 memory interface, Gigabit Ethernet, USB 3.0, and PCIe Gen3. Additionally, it is designed to be easily upgradable, allowing for future upgrades and modifications.


The XCZU49DR-1FFVF1760I chip model can be used in a variety of applications, including embedded systems, networking, and industrial automation. It is capable of supporting advanced communication systems, such as 5G, Wi-Fi 6, and Ethernet. Additionally, it is capable of supporting a wide range of protocols and standards, such as Ethernet, USB, and PCIe.


When using the XCZU49DR-1FFVF1760I chip model, it is important to consider the specific design requirements of the application. For example, the chip model should be able to support the specific protocol and standards required by the application. Additionally, the chip model should be able to support the specific data rates and throughputs required by the application. Finally, the chip model should be able to support the specific power requirements of the application.


The Xilinx XCZU49DR-1FFVF1760I chip model has been used in a variety of applications, including embedded systems, networking, and industrial automation. In these applications, it has proven to be a reliable and powerful solution. Additionally, it has been used in a wide range of case studies, such as the design of a Wi-Fi 6 access point, the development of a 5G base station, and the development of a high-performance data center.


In conclusion, the Xilinx XCZU49DR-1FFVF1760I chip model is a powerful and reliable solution for a variety of applications. It offers a high-performance, low-power 16nm FinFET+ process technology, a compact form factor, and a wide range of features. It is expected to experience significant demand in the coming years, especially in the fields of embedded systems and industrial automation. Additionally, it is capable of supporting advanced communication systems and a wide range of protocols and standards. When using the XCZU49DR-1FFVF1760I chip model, it is important to consider the specific design requirements of the application.



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