XCZU46DR-2FFVH1760I
XCZU46DR-2FFVH1760I
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rohs

AMD Xilinx

XCZU46DR-2FFVH1760I


XCZU46DR-2FFVH1760I
F20-XCZU46DR-2FFVH1760I
Active
CMOS, FLIPCHIP-1760
FLIPCHIP-1760

XCZU46DR-2FFVH1760I ECAD Model


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XCZU46DR-2FFVH1760I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1760
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FLIPCHIP-1760
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Date Of Intro 2019-02-20

XCZU46DR-2FFVH1760I Datasheet Download


XCZU46DR-2FFVH1760I Overview



The chip model XCZU46DR-2FFVH1760I is a new generation of FPGA chip designed by Xilinx. It is a high-performance, low-power, and cost-effective chip, which is widely used in various fields such as communication, industrial control, and artificial intelligence. With the development of technology, the chip model XCZU46DR-2FFVH1760I is becoming more and more popular.


In terms of industry trends, the chip model XCZU46DR-2FFVH1760I is the best choice for companies that need fast and reliable performance. Its built-in programmable logic blocks and high-performance memory blocks can provide the highest performance, while its low-power design can reduce power consumption. In addition, its high-speed transceivers and high-speed serial links can provide high-speed data transmission, making it suitable for advanced communication systems.


In terms of future development, the chip model XCZU46DR-2FFVH1760I can be upgraded with new technologies to meet the needs of new applications. For example, the chip model can be upgraded with new technologies such as artificial intelligence, machine learning, and deep learning to enable it to be applied to the development and popularization of future intelligent robots. In addition, the chip model can also be upgraded with new technologies such as high-speed interconnects and high-speed serial links to meet the needs of new applications.


In terms of technical talents, it is necessary for engineers to have a solid understanding of the chip model XCZU46DR-2FFVH1760I and its related technologies in order to use the model effectively. Engineers should have a good understanding of the FPGA architecture, the programmable logic blocks, the high-speed transceivers and the high-speed serial links. In addition, they should also have a good understanding of the development tools, the programming languages, and the software development platforms.


In conclusion, the chip model XCZU46DR-2FFVH1760I is a powerful and cost-effective FPGA chip that is suitable for various applications. With the development of technology, the chip model can be upgraded with new technologies to meet the needs of new applications. Technical talents with a solid understanding of the chip model and its related technologies are needed to use the model effectively.



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