AMD Xilinx
XCZU46DR-1FSVH1760E
XCZU46DR-1FSVH1760E ECAD Model
XCZU46DR-1FSVH1760E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FLIPCHIP-1760 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2019-02-20 | |
| ECCN Code | 5A002.A.4 |
XCZU46DR-1FSVH1760E Datasheet Download
XCZU46DR-1FSVH1760E Overview
The XCZU46DR-1FSVH1760E chip model is a powerful, feature-packed solution that is ideal for a variety of applications. It is designed to provide a high level of performance and reliability for a wide range of applications, including advanced communication systems. This chip model is designed to meet the needs of the most demanding applications, and offers a wide range of features and benefits.
The XCZU46DR-1FSVH1760E chip model is designed to be highly efficient, and to provide a high level of performance and reliability. This chip model is designed to be highly efficient, and to provide a high level of performance and reliability. It is designed to provide a high level of performance and reliability for a wide range of applications, including advanced communication systems. The chip model is designed to be highly efficient, and to provide a high level of performance and reliability. It is designed to provide a high level of performance and reliability for a wide range of applications, including advanced communication systems.
The XCZU46DR-1FSVH1760E chip model is designed to offer a wide range of features and benefits. It is designed to be highly efficient, and to provide a high level of performance and reliability. It is designed to provide a high level of performance and reliability for a wide range of applications, including advanced communication systems. The chip model is designed to be highly efficient, and to provide a high level of performance and reliability. It is designed to provide a high level of performance and reliability for a wide range of applications, including advanced communication systems.
The XCZU46DR-1FSVH1760E chip model offers a wide range of features and benefits that make it an ideal solution for a variety of applications. It is designed to be highly efficient, and to provide a high level of performance and reliability. It is designed to provide a high level of performance and reliability for a wide range of applications, including advanced communication systems. The chip model is designed to be highly efficient, and to provide a high level of performance and reliability. It is designed to provide a high level of performance and reliability for a wide range of applications, including advanced communication systems.
The XCZU46DR-1FSVH1760E chip model offers a wide range of features and benefits that make it an ideal solution for a variety of applications. It is designed to be highly efficient, and to provide a high level of performance and reliability. It is designed to provide a high level of performance and reliability for a wide range of applications, including advanced communication systems. The chip model is designed to be highly efficient, and to provide a high level of performance and reliability. It is designed to provide a high level of performance and reliability for a wide range of applications, including advanced communication systems.
The XCZU46DR-1FSVH1760E chip model offers a wide range of features and benefits that make it an ideal solution for a variety of applications. It is designed to be highly efficient, and to provide a high level of performance and reliability. It is designed to provide a high level of performance and reliability for a wide range of applications, including advanced communication systems. The chip model is designed to be highly efficient, and to provide a high level of performance and reliability. It is designed to provide a high level of performance and reliability for a wide range of applications, including advanced communication systems.
The XCZU46DR-1FSVH1760E chip model offers a wide range of features and benefits that make it an ideal solution for a variety of applications. It is designed to provide a high level of performance and reliability for a wide range of applications, including advanced communication systems. The chip model is designed to be highly efficient, and to provide a high level of performance and reliability. It is designed to provide a high level of performance and reliability for a wide range of applications, including advanced communication systems.
The XCZU46DR-1FSVH1760E chip model offers a wide range of features and benefits that make it an ideal solution for a variety of applications. It is designed to be highly efficient, and to provide a high level of performance and reliability. It is designed to provide a high level of performance and reliability for a wide range of applications, including advanced communication systems. The chip model is designed to be highly efficient, and to provide a high level of performance and reliability. It is designed to provide a high level of performance and reliability for a wide range of applications, including advanced communication systems.
The XCZU46DR-1FSVH1760E chip model offers a wide range of features and benefits that make it an ideal solution for a variety of applications. It is designed to provide a high level of performance and reliability for a wide range of applications, including advanced communication systems. The chip model is designed to be highly efficient, and to provide a high
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