XCZU3EG-2SFVC784I
XCZU3EG-2SFVC784I
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rohs

AMD Xilinx

XCZU3EG-2SFVC784I


XCZU3EG-2SFVC784I
F20-XCZU3EG-2SFVC784I
Active
CMOS, FCBGA-784
FCBGA-784

XCZU3EG-2SFVC784I ECAD Model


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XCZU3EG-2SFVC784I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B784
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 784
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FCBGA-784
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU3EG-2SFVC784I Datasheet Download


XCZU3EG-2SFVC784I Overview



The XCZU3EG-2SFVC784I chip model is one of the most advanced models of its kind and is becoming increasingly popular in the semiconductor industry. This model is a high-performance, low-power, and cost-effective chip model, making it a great choice for a wide range of applications.


The XCZU3EG-2SFVC784I chip model offers a number of advantages, such as its high-speed performance, low-power consumption, and cost-effectiveness. It also offers a wide range of features, such as support for multiple I/O interfaces, advanced security features, and high-speed data transfer. This makes the XCZU3EG-2SFVC784I chip model an ideal choice for a variety of applications, from network and storage applications to industrial and consumer applications.


The demand for the XCZU3EG-2SFVC784I chip model is expected to continue to grow in the future, as it is a great choice for a wide range of applications. In addition, the chip model can be used in a variety of intelligent scenarios, such as in networks, storage, and industrial applications. This chip model can also be used in the era of fully intelligent systems, as it offers support for advanced security features and high-speed data transfer.


The XCZU3EG-2SFVC784I chip model can also be applied to the development and popularization of future intelligent robots. This chip model can be used to power a variety of intelligent robots, such as autonomous vehicles, robots for medical applications, and robots for manufacturing and logistics. To use the XCZU3EG-2SFVC784I chip model effectively, technical talents such as engineers, programmers, and designers are needed to create the necessary hardware and software for the robots.


In conclusion, the XCZU3EG-2SFVC784I chip model is one of the most advanced models of its kind and is becoming increasingly popular in the semiconductor industry. It offers a number of advantages, such as its high-speed performance, low-power consumption, and cost-effectiveness. The demand for this chip model is expected to continue to grow in the future, as it can be used in a variety of applications, from networks and storage applications to industrial and consumer applications. Additionally, the chip model can be used in the era of fully intelligent systems and can be applied to the development and popularization of future intelligent robots. To use the XCZU3EG-2SFVC784I chip model effectively, technical talents such as engineers, programmers, and designers are needed to create the necessary hardware and software for the robots.



3,272 In Stock


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Unit Price: $36.0342
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $33.5118 $33.5118
10+ $33.1515 $331.5146
100+ $31.3498 $3,134.9754
1000+ $29.5480 $14,774.0220
10000+ $27.0257 $27,025.6500
The price is for reference only, please refer to the actual quotation!

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