
AMD Xilinx
XCZU3EG-2SFVC784I
XCZU3EG-2SFVC784I ECAD Model
XCZU3EG-2SFVC784I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B784 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 784 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | FCBGA-784 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU3EG-2SFVC784I Datasheet Download
XCZU3EG-2SFVC784I Overview
The XCZU3EG-2SFVC784I chip model is one of the most advanced models of its kind and is becoming increasingly popular in the semiconductor industry. This model is a high-performance, low-power, and cost-effective chip model, making it a great choice for a wide range of applications.
The XCZU3EG-2SFVC784I chip model offers a number of advantages, such as its high-speed performance, low-power consumption, and cost-effectiveness. It also offers a wide range of features, such as support for multiple I/O interfaces, advanced security features, and high-speed data transfer. This makes the XCZU3EG-2SFVC784I chip model an ideal choice for a variety of applications, from network and storage applications to industrial and consumer applications.
The demand for the XCZU3EG-2SFVC784I chip model is expected to continue to grow in the future, as it is a great choice for a wide range of applications. In addition, the chip model can be used in a variety of intelligent scenarios, such as in networks, storage, and industrial applications. This chip model can also be used in the era of fully intelligent systems, as it offers support for advanced security features and high-speed data transfer.
The XCZU3EG-2SFVC784I chip model can also be applied to the development and popularization of future intelligent robots. This chip model can be used to power a variety of intelligent robots, such as autonomous vehicles, robots for medical applications, and robots for manufacturing and logistics. To use the XCZU3EG-2SFVC784I chip model effectively, technical talents such as engineers, programmers, and designers are needed to create the necessary hardware and software for the robots.
In conclusion, the XCZU3EG-2SFVC784I chip model is one of the most advanced models of its kind and is becoming increasingly popular in the semiconductor industry. It offers a number of advantages, such as its high-speed performance, low-power consumption, and cost-effectiveness. The demand for this chip model is expected to continue to grow in the future, as it can be used in a variety of applications, from networks and storage applications to industrial and consumer applications. Additionally, the chip model can be used in the era of fully intelligent systems and can be applied to the development and popularization of future intelligent robots. To use the XCZU3EG-2SFVC784I chip model effectively, technical talents such as engineers, programmers, and designers are needed to create the necessary hardware and software for the robots.
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3,272 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $33.5118 | $33.5118 |
10+ | $33.1515 | $331.5146 |
100+ | $31.3498 | $3,134.9754 |
1000+ | $29.5480 | $14,774.0220 |
10000+ | $27.0257 | $27,025.6500 |
The price is for reference only, please refer to the actual quotation! |