
AMD Xilinx
XCZU2EG-L2SFVC784E
XCZU2EG-L2SFVC784E ECAD Model
XCZU2EG-L2SFVC784E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 720 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
Supply Voltage-Max | 742 mV | |
Supply Voltage-Min | 698 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B784 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 110 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 784 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | FCBGA-784 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU2EG-L2SFVC784E Datasheet Download
XCZU2EG-L2SFVC784E Overview
The chip model XCZU2EG-L2SFVC784E is a high-performance, low-power, cost-effective FPGA chip developed by Xilinx, Inc. It is designed to meet the needs of a variety of applications. The chip model XCZU2EG-L2SFVC784E offers superior performance and scalability, allowing users to easily configure their hardware to meet their specific needs.
The XCZU2EG-L2SFVC784E chip model is equipped with a rich set of features, including an integrated ARM Cortex-A9 processor, dual-core floating-point unit, up to 8GB of DDR3 memory, and up to 8GB of QDR4+ memory. It also includes a high-performance, low-power, 16nm UltraScale+ FPGA fabric, which provides up to 2.5TFLOPS of performance. Additionally, the chip model is equipped with a variety of I/O options, including up to four 10Gbps Ethernet ports, four USB 3.0 ports, four SATA ports, and up to four PCIe Gen3 ports, as well as a variety of other I/O options.
The chip model XCZU2EG-L2SFVC784E is designed to provide a wide range of applications, including embedded systems, industrial automation, machine learning, vision processing, and more. As the demand for these applications increases, the XCZU2EG-L2SFVC784E chip model is expected to become increasingly popular in the near future.
In terms of product description and design requirements, the XCZU2EG-L2SFVC784E chip model is designed to meet the needs of a variety of applications. It is equipped with a variety of features, including an integrated ARM Cortex-A9 processor, dual-core floating-point unit, up to 8GB of DDR3 memory, and up to 8GB of QDR4+ memory. Additionally, the chip model is equipped with a high-performance, low-power, 16nm UltraScale+ FPGA fabric, which provides up to 2.5TFLOPS of performance.
In terms of actual case studies, the XCZU2EG-L2SFVC784E chip model has been used in a variety of applications, including embedded systems, industrial automation, machine learning, vision processing, and more. For example, the chip model was used in an industrial automation system to control a robotic arm. In this case, the chip model was used to provide the necessary processing power and features to control the robotic arm.
Finally, when it comes to precautions, users should be aware that the XCZU2EG-L2SFVC784E chip model is not compatible with all technologies. Therefore, users should research the specific technologies needed for their application environment before purchasing the chip model. Additionally, users should take the time to read the product documentation and familiarize themselves with the features and specifications of the chip model before making a purchase.
In conclusion, the XCZU2EG-L2SFVC784E chip model is a high-performance, low-power, cost-effective FPGA chip developed by Xilinx, Inc. It is designed to meet the needs of a variety of applications and is equipped with a variety of features, including an integrated ARM Cortex-A9 processor, dual-core floating-point unit, up to 8GB of DDR3 memory, and up to 8GB of QDR4+ memory. The chip model has been used in a variety of applications, including embedded systems, industrial automation, machine learning, vision processing, and more. However, users should research the specific technologies needed for their application environment before purchasing the chip model, and take the time to read the product documentation and familiarize themselves with the features and specifications of the chip model before making a purchase.
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3,992 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $332.7168 | $332.7168 |
10+ | $329.1392 | $3,291.3920 |
100+ | $311.2512 | $31,125.1200 |
1000+ | $293.3632 | $146,681.6000 |
10000+ | $268.3200 | $268,320.0000 |
The price is for reference only, please refer to the actual quotation! |