AMD Xilinx
XCVU9P-1FLGC2104I
XCVU9P-1FLGC2104I ECAD Model
XCVU9P-1FLGC2104I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 850 mV | |
| Number of Inputs | 832 | |
| Number of Outputs | 832 | |
| Number of Logic Cells | 2586150 | |
| Number of CLBs | 147780 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 147780 CLBS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| JESD-30 Code | S-PBGA-B2104 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 2104 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA2104,46X46,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 47.5 mm | |
| Length | 47.5 mm | |
| Seated Height-Max | 4.32 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.B | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2016-06-03 |
XCVU9P-1FLGC2104I Datasheet Download
XCVU9P-1FLGC2104I Overview
The chip model XCVU9P-1FLGC2104I is a powerful and versatile model that can be used for high-performance digital signal processing, embedded processing, image processing, and other applications. It requires the use of HDL language, which is a hardware description language used to describe the behavior of digital circuits.
The industry trends of the chip model XCVU9P-1FLGC2104I and the future development of related industries depend on what specific technologies are needed. For example, if the application environment requires the support of new technologies, such as artificial intelligence (AI) or machine learning (ML), then the chip model XCVU9P-1FLGC2104I can be used to develop and popularize future intelligent robots. In order to use the model effectively, technical talents that are familiar with the HDL language and related technologies are needed.
The chip model XCVU9P-1FLGC2104I is a powerful tool for digital signal processing, embedded processing, and image processing. It is also capable of being used for the development and popularization of future intelligent robots as long as the application environment requires the support of new technologies. In order to use the model effectively, technical talents that are familiar with the HDL language and related technologies are needed.
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2,952 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $28,747.5797 | $28,747.5797 |
| 10+ | $28,438.4659 | $284,384.6592 |
| 100+ | $26,892.8971 | $2,689,289.7120 |
| 1000+ | $25,347.3283 | $12,673,664.1600 |
| 10000+ | $23,183.5320 | $23,183,532.0000 |
| The price is for reference only, please refer to the actual quotation! | ||