
AMD Xilinx
XCVU9P-1FLGB2104I
XCVU9P-1FLGB2104I ECAD Model
XCVU9P-1FLGB2104I Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex® UltraScale+™ | |
Package | Tray | |
Number of LABs/CLBs | 147780 | |
Number of Logic Elements/Cells | 2586150 | |
Total RAM Bits | 391168000 | |
Number of I/O | 702 | |
Voltage - Supply | 0.825V ~ 0.876V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 2104-BBGA, FCBGA | |
Supplier Device Package | 2104-FCBGA (47.5x47.5) | |
Base Product Number | XCVU9 |
XCVU9P-1FLGB2104I Datasheet Download
XCVU9P-1FLGB2104I Overview
The XCVU9P-1FLGB2104I is a high-performance FPGA chip from Xilinx. It is based on the Xilinx UltraScale+ architecture and is built using the 16 nm FinFET process. This chip contains 9,152 logic cells, 8.4Mb of block RAM, and 4,608 DSP slices. It has a total of 8,400 user I/O pins, with support for up to 32 high-speed transceivers.
The XCVU9P-1FLGB2104I has a maximum clock frequency of 1.2GHz and a total power dissipation of up to 250W. It is designed to operate at temperatures between 0 and 85°C. The chip is also equipped with a range of advanced features, such as integrated power management, advanced error correction, and advanced encryption.
The XCVU9P-1FLGB2104I is ideal for applications that require high performance and reliability, such as 5G wireless communication, data centers, artificial intelligence and machine learning, video processing, and automotive, aerospace and defense applications. It is also suitable for a wide range of other applications, such as networking, storage, and embedded systems.
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3,636 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $36,915.0257 | $36,915.0257 |
10+ | $36,518.0899 | $365,180.8992 |
100+ | $34,533.4111 | $3,453,341.1120 |
1000+ | $32,548.7323 | $16,274,366.1600 |
10000+ | $29,770.1820 | $29,770,182.0000 |
The price is for reference only, please refer to the actual quotation! |