XCVU35P-3FSVH2104E

The XCVU35P-3FSVH2104E is an advanced chip model developed by Xilinx, Inc. It is a Field Programmable Gate Array (FPGA) that is designed to provide high-performance computing, networking, and storage capabilities. This chip model is based on the Xilinx UltraScale+ architecture and is manufactured using TSMC's 16nm FinFET process.

The XCVU35P-3FSVH2104E chip model has a total of 3,904 logic cells, 2,104 DSP slices, and 6,144 Kbits of block RAM. It also includes 68 user I/Os, two GTH transceivers, and two GTY transceivers. It supports a wide variety of protocols such as DDR4, PCIe, and 10G Ethernet. This chip model also features a low-power design with a maximum power consumption of 15W.

The XCVU35P-3FSVH2104E chip model is suitable for a variety of applications, including high-performance computing, networking, storage, and embedded systems. It can be used for data processing, machine learning, and artificial intelligence applications. It can also be used for developing embedded systems such as industrial automation, medical devices, and automotive systems. Additionally, the chip model can be used for developing wireless systems such as 5G base stations and Wi-Fi access points.