XCVU5P-1FLVB2104I

The XCVU5P-1FLVB2104I chip model is a high performance, low power, field programmable gate array (FPGA) device from Xilinx. It is based on the 5th generation UltraScale+ architecture and is designed for applications requiring high performance, low latency and high system integration. It is suitable for a wide range of applications, including 5G wireless, networking, data center, automotive, industrial, and military.

The XCVU5P-1FLVB2104I chip model has a capacity of 1.5 million logic cells, 8.2 million system gates, and 4.5 million flip-flops. It features a total of 1460 DSP slices, 8.2 million system gates, and 4.5 million flip-flops. It has a total of two banks of on-chip memory, each with a capacity of up to 32MB. It also has a total of four banks of on-chip memory for configuration, each with a capacity of up to 8MB.

The XCVU5P-1FLVB2104I chip model supports a wide range of I/O standards, including LVDS, LVCMOS, SSTL, HSTL, and PCI Express. It also supports multiple clock domains and has integrated clock management blocks. It has a power dissipation of up to 15W and an operating temperature range of -40°C to +100°C.

The XCVU5P-1FLVB2104I chip model is suitable for a wide range of applications, including 5G wireless, networking, data center, automotive, industrial, and military. It is ideal for applications that require high performance, low latency, and high system integration. It is also suitable for applications that require high-speed serial links and multiple clock domains.