XCVU23P-2VSVA1365E

The XCVU23P-2VSVA1365E is a high-performance, low-power, multi-core FPGA (Field Programmable Gate Array) chip designed by Xilinx. It is based on the Virtex Ultrascale+ family of FPGA chips, and is built on a 16nm process technology. It has a total of 23,000 logic cells, with a total of 2,817,280 look-up tables and 2,817,280 flip-flops. It has a total of 17,280 DSP slices and 2,048 block RAMs. The chip supports a total of 32 transceivers, with a data rate of up to 28.05 Gbps. It also supports up to 72 high-speed SERDES transceivers, with a data rate of up to 28.05 Gbps.

The XCVU23P-2VSVA1365E chip is suitable for a wide range of applications, including high-speed networking, video/image processing, data acquisition/analysis, and embedded systems. It is ideal for applications such as storage, cloud computing, and data centers. It can also be used in automotive, aerospace, and defense applications. It is designed to provide high-performance and low-power operation, enabling it to be used in a wide range of embedded and high-performance applications.

The XCVU23P-2VSVA1365E chip is designed to provide high-performance and low-power operation, enabling it to be used in a wide range of embedded and high-performance applications. It is designed to provide a high level of flexibility, allowing users to customize their designs to meet their specific requirements. It is a highly reliable and robust chip, making it suitable for mission-critical applications.