XCVU11P-3FSGD2104E

The XCVU11P-3FSGD2104E chip is an FPGA (Field Programmable Gate Array) manufactured by Xilinx. It is a powerful and versatile chip, designed to enable rapid prototyping and development of complex digital circuits.

The XCVU11P-3FSGD2104E is a 28nm UltraScale+ FPGA. It has a total of 4,300 logic cells, with up to 4,096 Kbits of block RAM, and up to 8,192 18x18 multipliers. It has a total of 8,192 DSP slices, which can be used to perform various arithmetic operations. It also has up to 4,096 Kbits of UltraRAM and up to 4,096 Kbits of UltraRAM Plus.

The chip has two banks of high-bandwidth memory (HBM2) interfaces, with up to 16Gbps of bandwidth each. It also has a PCIe Gen4 x16 interface, giving it up to 32Gbps of bandwidth.

The XCVU11P-3FSGD2104E is suitable for a wide range of applications, including high-speed networking, video processing, machine learning, and AI applications. It is also suitable for applications that require high-speed data transfer, such as data centers, storage networks, and 5G networks.

Overall, the XCVU11P-3FSGD2104E is a powerful and versatile FPGA, suitable for a wide range of applications. It offers high-performance, high-bandwidth, and low-power operation, making it an ideal choice for embedded systems and data-intensive applications.