AMD Xilinx
XCV800-6HQ240I
XCV800-6HQ240I ECAD Model
XCV800-6HQ240I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 166 | |
| Number of Outputs | 166 | |
| Number of Logic Cells | 21168 | |
| Number of Equivalent Gates | 888439 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 888439 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Equivalence Code | HQFP240,1.37SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | HEAT SINK, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV800-6HQ240I Datasheet Download
XCV800-6HQ240I Overview
The XCV800-6HQ240I chip model is a state-of-the-art integrated circuit that has been designed to meet the needs of modern communication systems. It is a highly versatile device that offers a wide range of features and capabilities that can be used to improve the performance of communication systems.
The XCV800-6HQ240I chip model is designed to provide high-speed data transmission, low-power operation, and reliable operation in harsh environments. It is a highly integrated device that combines a variety of functions including digital signal processing, analog signal processing, and data storage. It also includes a wide range of communication protocols such as Ethernet, Wi-Fi, and Bluetooth. The device is designed to be used in a wide range of applications including industrial, automotive, and medical.
The XCV800-6HQ240I chip model is designed to be highly reliable and efficient. It is designed to be able to withstand harsh environmental conditions such as high temperatures and humidity. It also has a wide range of features that make it suitable for a variety of applications. These features include a high-speed data transmission rate, low-power operation, and reliable operation in harsh environments.
The XCV800-6HQ240I chip model is also designed to be highly upgradable. It is designed to be able to accommodate new technologies and features as they become available. This makes it suitable for a wide range of applications and allows for future upgrades and enhancements.
In terms of the industry trends of the XCV800-6HQ240I chip model, it is expected that the demand for such devices will continue to increase as more applications require the support of new technologies. The device is also expected to be used in more advanced communication systems due to its high-speed data transmission rate and low-power operation.
In terms of the product description and specific design requirements of the XCV800-6HQ240I chip model, it is designed to meet the needs of modern communication systems. It is designed to provide high-speed data transmission, low-power operation, and reliable operation in harsh environments. It also includes a wide range of communication protocols such as Ethernet, Wi-Fi, and Bluetooth.
In addition, there are a number of actual case studies and precautions that need to be taken when using the XCV800-6HQ240I chip model. For example, it is important to ensure that the device is properly cooled and that it is not exposed to extreme temperatures. It is also important to ensure that the device is properly shielded from electromagnetic interference.
Overall, the XCV800-6HQ240I chip model is a highly versatile device that offers a wide range of features and capabilities that can be used to improve the performance of communication systems. It is designed to be highly reliable and efficient and is expected to be used in more advanced communication systems due to its high-speed data transmission rate and low-power operation. In addition, there are a number of actual case studies and precautions that need to be taken when using the device.
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