AMD Xilinx
XCV600E-8FGG680C
XCV600E-8FGG680C ECAD Model
XCV600E-8FGG680C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 512 | |
| Number of Outputs | 512 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 186624 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 186624 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B680 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 680 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA680,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-680 | |
| Pin Count | 680 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XCV600E-8FGG680C Datasheet Download
XCV600E-8FGG680C Overview
The chip model XCV600E-8FGG680C is a high-performance, low-power, and cost-effective chip model that is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, image processing, and so on. It requires the use of HDL language, which is the standard hardware description language used to describe the behavior of digital circuits.
This chip model is widely used in a variety of industries, such as automotive, aerospace, medical, industrial, and consumer electronics. It is also used in many emerging technologies, such as artificial intelligence, machine learning, and Internet of Things. The chip model is highly optimized for each application, providing the best performance and power efficiency.
The chip model XCV600E-8FGG680C has a number of advantages compared to other chip models. It offers high-performance, low-power, and cost-effective solutions. It also supports a wide range of peripherals, such as Ethernet, USB, and PCIe. It is also highly scalable, allowing for easy integration into existing systems.
The chip model XCV600E-8FGG680C is expected to have a strong demand in the future, as more and more applications require the use of advanced technologies. It is expected to be widely used in emerging technologies, such as artificial intelligence, machine learning, and Internet of Things. The chip model is also expected to be used in a variety of industries, such as automotive, aerospace, medical, industrial, and consumer electronics.
In order to ensure the successful application of the chip model XCV600E-8FGG680C, it is important to consider the specific technologies needed for the application environment. For example, if the application requires the use of advanced technologies, such as artificial intelligence, machine learning, or Internet of Things, then the chip model should be designed to support these technologies.
Overall, the chip model XCV600E-8FGG680C is a highly optimized and cost-effective solution for a wide range of applications. It is expected to be widely used in a variety of industries in the future, as more and more applications require the use of advanced technologies. In order to ensure the successful application of the chip model, it is important to consider the specific technologies needed for the application environment.
You May Also Be Interested In
5,034 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $208.3200 | $208.3200 |
| 10+ | $206.0800 | $2,060.8000 |
| 100+ | $194.8800 | $19,488.0000 |
| 1000+ | $183.6800 | $91,840.0000 |
| 10000+ | $168.0000 | $168,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||